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• W2890499498 abstract "This study examined the joining of SiC fiber-reinforced SiC matrix composites (SiCf/SiC) using a Ti3AlC2 MAX phase filler and the possibility of eliminating the joining layer via solid-state diffusion upon the decomposition of Ti3AlC2. The base SiCf/SiC was fabricated by electrophoretic deposition (EPD) combined with hot pressing after adding a 10 wt% Al2O3-Y2O3 sintering additive. Two types of base SiCf/SiC with a density of 93% and 96% were prepared by hot pressing at 1750 °C without and with SiC tape insertion, respectively, followed by joining at 1700 or 1900 °C for 5 h under 3.5 MPa in an Ar atmosphere. The SiCf/SiC with tape insertion showed feasible elimination of the joining layer after joining at 1900 °C, whereas the composite joined at 1700 °C revealed the presence of a joining filler due to incomplete decomposition of the Ti3AlC2 filler. All samples showed fracturing at the joining interface during the flexural test, showing a joining strength of 180–255 MPa depending on the preparation conditions. The properties of the SiCf/SiC joints were explained by the surface roughness, microstructure, and phase evolution upon decomposition of the Ti3AlC2 filler." @default.
• W2890499498 created "2018-09-27" @default.
• W2890499498 creator A5002223924 @default.
• W2890499498 creator A5002992836 @default.
• W2890499498 date "2018-12-01" @default.
• W2890499498 modified "2023-10-16" @default.
• W2890499498 title "Joining of SiCf/SiC using a Ti3AlC2 filler and subsequent elimination of the joining layer" @default.
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• W2890499498 doi "https://doi.org/10.1016/j.ceramint.2018.09.090" @default.
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