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- W2890789593 abstract "Abstract Cu/Ti bilayers were magnetron sputtered onto a diamond substrate to simulate interfaces in diamond particles reinforced Cu matrix (Cu/diamond) composites. The Cu/Ti/diamond system was tuned to Cu/Ti/TiC/diamond and Cu/TiC/diamond structures by annealing the Ti interlayer at 1073 K. The interfacial thermal conductance (G) between Cu and diamond was experimentally measured by a time-domain thermoreflectance (TDTR) technique to investigate the dependence of the G on the Cu/interlayer/diamond structure. The Cu/TiC/diamond structure exhibits higher G of 76 MW m−2 K−1 than the Cu/Ti/TiC/diamond of 60 MW m−2 K−1, the Cu/Ti/diamond of 30 MW m−2 K−1, the as-deposited Cu/diamond of 66 MW m−2 K−1, and the annealed Cu/diamond of" @default.
- W2890789593 created "2018-09-27" @default.
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- W2890789593 date "2018-11-01" @default.
- W2890789593 modified "2023-10-14" @default.
- W2890789593 title "Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond" @default.
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- W2890789593 doi "https://doi.org/10.1016/j.actamat.2018.09.004" @default.
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