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• W2890853310 endingPage "11UF05" @default.
• W2890853310 startingPage "11UF05" @default.
• W2890853310 abstract "Disclosed is a method for forming a silver film for increased electrical properties by using an aerosol deposition process. A simple room temperature aerosol deposition (AD) process is used to form a silver thick film for high-efficiency metallization, which can be applied to reduce a resistance-capacitance delay and increase a signal propagation rate in an integrated circuit. In order to obtain more increased performance than an aerosol-deposited silver film reported in a previous study, experimental parameters (gas consumption and an orifice size of a nozzle) which can directly affect electrical resistivity were first optimized. A small orifice size was chosen, which is suitable to promote the reduction in electrical resistivity by activating an osmotic effect and creating more conductive channels. In addition, high gas consumption reduces the electrical resistivity of the silver film, thereby forming many metal clusters. The experimental parameters showing the lowest resistance are used to form the silver thick film through the AD process, and the properties of the same were analyzed. The results of X-ray diffraction confirmed that the silver particles corrected collision-induced plastic deformation. As the film thickness became thicker up to 12 scans, collided particles filled a coarse alumina substrate. After 12 scans, the silver film was densified due to severe plastic deformation of the deposited-silver particles. Therefore, a growth mechanism suggested that most of the silver particles in an initial deposition step contribute to mechanical interlocking, and the subsequent particles cause film densification." @default.
• W2890853310 created "2018-09-27" @default.
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• W2890853310 date "2018-09-03" @default.
• W2890853310 modified "2023-09-23" @default.
• W2890853310 title "Formation of silver films for advanced electrical properties by using aerosol deposition process" @default.
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• W2890853310 doi "https://doi.org/10.7567/jjap.57.11uf05" @default.
• W2890853310 hasPublicationYear "2018" @default.
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