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- W2890864861 abstract "The electromigration performance of solder balls has been characterized in terms of its failure mechanism, process legs and current distribution. Through extensive failure analysis, a step-by-step mechanism of electromigration failure has been identified, which begins with the formation of CuSn at the expense of the under-bump metallurgy and nearby solder, followed by the nucleation and growth of voids along the CuSn-Sn interface until open circuit failure. Lifetime gains proportional to the thickness of the under-bump metallurgy and/or the redistribution layer have been measured. Finally, current distribution was observed to play a large role in EM lifetime, in which splitting the current equally between balls greatly outlived those configured serially." @default.
- W2890864861 created "2018-09-27" @default.
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- W2890864861 date "2018-07-01" @default.
- W2890864861 modified "2023-09-25" @default.
- W2890864861 title "Electromigration Reliability of Solder Balls" @default.
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- W2890864861 doi "https://doi.org/10.1109/ipfa.2018.8452576" @default.
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