FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2891367246> ?p ?o ?g. }

• W2891367246 endingPage "44317" @default.
• W2891367246 startingPage "44306" @default.
• W2891367246 abstract "A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are challenging to realize because via holes in glass typically do not have a sufficiently high-quality sidewall profile for super-conformal electroplating of metal into the via holes. To overcome this problem, we demonstrate here that the via holes can instead be filled by magnetically assembling metal wires into them. This method was used to produce TGVs with a typical resistance of 64 mΩ, which is comparable with other metal TGV types reported in the literature. In contrast to many TGV designs with a hollow center, the proposed TGVs can be more area efficient by allowing solder bump placement directly on top of the TGVs, which was demonstrated here using solder-paste jetting. The magnetic assembly process can be parallelized using an assembly robot, which was found to provide an opportunity for increased wafer-scale assembly speed. The aforementioned qualities of the magnetically assembled TGVs allow the realization of glass interposers and MEMS packages in different thicknesses without the drawbacks associated with the current TGV fabrication methods." @default.
• W2891367246 created "2018-09-27" @default.
• W2891367246 creator A5003247411 @default.
• W2891367246 creator A5004612728 @default.
• W2891367246 creator A5006681830 @default.
• W2891367246 creator A5042010038 @default.
• W2891367246 creator A5042177405 @default.
• W2891367246 creator A5046651585 @default.
• W2891367246 creator A5058101553 @default.
• W2891367246 creator A5061066057 @default.
• W2891367246 creator A5085711393 @default.
• W2891367246 date "2018-01-01" @default.
• W2891367246 modified "2023-10-09" @default.
• W2891367246 title "Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires" @default.
• W2891367246 cites W1533213048 @default.
• W2891367246 cites W1597539317 @default.
• W2891367246 cites W1645226208 @default.
• W2891367246 cites W1975762650 @default.
• W2891367246 cites W1997230022 @default.
• W2891367246 cites W2005297859 @default.
• W2891367246 cites W2007197621 @default.
• W2891367246 cites W2012769618 @default.
• W2891367246 cites W2035057914 @default.
• W2891367246 cites W2035817882 @default.
• W2891367246 cites W2041652448 @default.
• W2891367246 cites W2067143020 @default.
• W2891367246 cites W2068187310 @default.
• W2891367246 cites W2072302933 @default.
• W2891367246 cites W2107868198 @default.
• W2891367246 cites W2126119727 @default.
• W2891367246 cites W2133308853 @default.
• W2891367246 cites W2146579635 @default.
• W2891367246 cites W2150143516 @default.
• W2891367246 cites W2167255138 @default.
• W2891367246 cites W2213266114 @default.
• W2891367246 cites W2242904037 @default.
• W2891367246 cites W2291790079 @default.
• W2891367246 cites W2496629310 @default.
• W2891367246 cites W2518432791 @default.
• W2891367246 cites W2541496805 @default.
• W2891367246 cites W2552221402 @default.
• W2891367246 cites W2554426741 @default.
• W2891367246 cites W2588316698 @default.
• W2891367246 cites W2594911905 @default.
• W2891367246 cites W2604645716 @default.
• W2891367246 cites W3103527158 @default.
• W2891367246 cites W4241952873 @default.
• W2891367246 cites W4252979015 @default.
• W2891367246 cites W2008103839 @default.
• W2891367246 doi "https://doi.org/10.1109/access.2018.2861886" @default.
• W2891367246 hasPublicationYear "2018" @default.
• W2891367246 type Work @default.
• W2891367246 sameAs 2891367246 @default.
• W2891367246 citedByCount "17" @default.
• W2891367246 countsByYear W28913672462019 @default.
• W2891367246 countsByYear W28913672462020 @default.
• W2891367246 countsByYear W28913672462021 @default.
• W2891367246 countsByYear W28913672462022 @default.
• W2891367246 countsByYear W28913672462023 @default.
• W2891367246 crossrefType "journal-article" @default.
• W2891367246 hasAuthorship W2891367246A5003247411 @default.
• W2891367246 hasAuthorship W2891367246A5004612728 @default.
• W2891367246 hasAuthorship W2891367246A5006681830 @default.
• W2891367246 hasAuthorship W2891367246A5042010038 @default.
• W2891367246 hasAuthorship W2891367246A5042177405 @default.
• W2891367246 hasAuthorship W2891367246A5046651585 @default.
• W2891367246 hasAuthorship W2891367246A5058101553 @default.
• W2891367246 hasAuthorship W2891367246A5061066057 @default.
• W2891367246 hasAuthorship W2891367246A5085711393 @default.
• W2891367246 hasBestOaLocation W28913672461 @default.
• W2891367246 hasConcept C100460472 @default.
• W2891367246 hasConcept C136525101 @default.
• W2891367246 hasConcept C142724271 @default.
• W2891367246 hasConcept C145420912 @default.
• W2891367246 hasConcept C158802814 @default.
• W2891367246 hasConcept C159985019 @default.
• W2891367246 hasConcept C160671074 @default.
• W2891367246 hasConcept C171250308 @default.
• W2891367246 hasConcept C179428855 @default.
• W2891367246 hasConcept C192562407 @default.
• W2891367246 hasConcept C204787440 @default.
• W2891367246 hasConcept C2779227376 @default.
• W2891367246 hasConcept C2780288131 @default.
• W2891367246 hasConcept C33923547 @default.
• W2891367246 hasConcept C37977207 @default.
• W2891367246 hasConcept C49040817 @default.
• W2891367246 hasConcept C50296614 @default.
• W2891367246 hasConcept C51807945 @default.
• W2891367246 hasConcept C71924100 @default.
• W2891367246 hasConceptScore W2891367246C100460472 @default.
• W2891367246 hasConceptScore W2891367246C136525101 @default.
• W2891367246 hasConceptScore W2891367246C142724271 @default.
• W2891367246 hasConceptScore W2891367246C145420912 @default.
• W2891367246 hasConceptScore W2891367246C158802814 @default.
• W2891367246 hasConceptScore W2891367246C159985019 @default.
• W2891367246 hasConceptScore W2891367246C160671074 @default.
• W2891367246 hasConceptScore W2891367246C171250308 @default.
• W2891367246 hasConceptScore W2891367246C179428855 @default.

• next