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- W2891842413 abstract "Room-temperature wafer bonding of 4-inch Si wafers with a few tens of nanometers thick Au films using Ar plasma surface activation was demonstrated for integrated plasmonic devices. Thermal stability of Cr/Au multilayer thin films was investigated by X-ray photoelectron spectroscopy (XPS). XPS measurements showed that annealing at 200 °C for 10 min resulted in considerable Cr diffusion and this indicates that low-temperature bonding is desirable for the integration of multilayer metal thin films." @default.
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- W2891842413 date "2018-07-01" @default.
- W2891842413 modified "2023-10-02" @default.
- W2891842413 title "Room-Temperature Wafer Bonding Using Smooth Au Thin Films for Integrated Plasmonic Devices" @default.
- W2891842413 doi "https://doi.org/10.1109/omn.2018.8454605" @default.
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