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- W2891945245 abstract "Self-assembled Au atoms were employed to bond vertical interconnection for chip-stacking applications without pressure and at a temperature of 50 °C. In this process, Au ions in an electroless plating solution are forced through a thin gap between Si chips. The Au atoms, reduced from Au ions, self-assemble between pairs of Cu pillars, and void-free connections are achieved with high joint strength. In addition, it has been shown that the Au grains grow epitaxially with the Cu grains. This epitaxial growth offers a potential method to align the Au grains to enhance electrical performance for future high frequency applications." @default.
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- W2891945245 date "2019-01-01" @default.
- W2891945245 modified "2023-10-15" @default.
- W2891945245 title "Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits" @default.
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- W2891945245 doi "https://doi.org/10.1016/j.scriptamat.2018.09.026" @default.
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