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• W2892333054 endingPage "51679" @default.
• W2892333054 startingPage "51669" @default.
• W2892333054 abstract "Light-emitting diodes (LEDs) have increasingly replaced conventional lamps in the fields of general lighting and consumer electronics. In addition to the sharp price fall, this is also due to the significantly higher energy efficiency and the smaller, more compact design. Recently, their robustness and reliability have also reached a level of quality that surpasses the characteristics of conventional light sources such as halogen and fluorescent lamps. Characteristics, such as excellent design freedom and the possibility for functional integration, highlight the main qualities of molded interconnect devices (MIDs). The use of this technology does not only open doors to extend the application field of LEDs to new products but also presents challenges to the lighting industry. There are many studies dealing with the reliability of LEDs as well as with the usability of the MID technology in different fields. But, the lack of experience from the manufacturers regarding the behavior of this interesting configuration (LED/MID) over the entire life cycle prevents this technology from establishing and consolidating its existence. As LEDs in the automotive sector, especially within headlamps, assume increasingly powerful lighting tasks and are no longer used exclusively for signal transfer or for displays, thermal properties of the substrate materials and the thermo-mechanical behavior of the assembly are particularly relevant. In this context, this paper presents a deep and detailed reliability investigation of this system (LED/MID) and examines the influence of the MID substrate choice on the long-term performance of the LED. The impact of the forward current and of the ambient temperature on the junction temperature of the LED is a proven fact. Therefore, the MID effect was inspected under different operating conditions based on infrared thermography. After analyzing the occurred failure mechanisms, by means of X-ray analysis, thermal transient testing and microscopy, the resulting lifetime model is also presented and discussed." @default.
• W2892333054 created "2018-09-27" @default.
• W2892333054 creator A5001312457 @default.
• W2892333054 creator A5059247327 @default.
• W2892333054 creator A5070162333 @default.
• W2892333054 creator A5075902829 @default.
• W2892333054 creator A5088803774 @default.
• W2892333054 creator A5091750497 @default.
• W2892333054 date "2018-01-01" @default.
• W2892333054 modified "2023-09-23" @default.
• W2892333054 title "Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB" @default.
• W2892333054 cites W1487347259 @default.
• W2892333054 cites W1972322692 @default.
• W2892333054 cites W1983149712 @default.
• W2892333054 cites W2011539370 @default.
• W2892333054 cites W2041072610 @default.
• W2892333054 cites W2067549689 @default.
• W2892333054 cites W2092451631 @default.
• W2892333054 cites W2134607678 @default.
• W2892333054 cites W2139752984 @default.
• W2892333054 cites W2149334484 @default.
• W2892333054 cites W2151406039 @default.
• W2892333054 cites W2152839995 @default.
• W2892333054 cites W2188678634 @default.
• W2892333054 cites W2222100596 @default.
• W2892333054 cites W2520598575 @default.
• W2892333054 cites W2552172458 @default.
• W2892333054 cites W2766725516 @default.
• W2892333054 cites W2802197112 @default.
• W2892333054 cites W4254372166 @default.
• W2892333054 cites W1975699451 @default.
• W2892333054 doi "https://doi.org/10.1109/access.2018.2869017" @default.
• W2892333054 hasPublicationYear "2018" @default.
• W2892333054 type Work @default.
• W2892333054 sameAs 2892333054 @default.
• W2892333054 citedByCount "11" @default.
• W2892333054 countsByYear W28923330542018 @default.
• W2892333054 countsByYear W28923330542019 @default.
• W2892333054 countsByYear W28923330542020 @default.
• W2892333054 countsByYear W28923330542021 @default.
• W2892333054 countsByYear W28923330542022 @default.
• W2892333054 countsByYear W28923330542023 @default.
• W2892333054 crossrefType "journal-article" @default.
• W2892333054 hasAuthorship W2892333054A5001312457 @default.
• W2892333054 hasAuthorship W2892333054A5059247327 @default.
• W2892333054 hasAuthorship W2892333054A5070162333 @default.
• W2892333054 hasAuthorship W2892333054A5075902829 @default.
• W2892333054 hasAuthorship W2892333054A5088803774 @default.
• W2892333054 hasAuthorship W2892333054A5091750497 @default.
• W2892333054 hasBestOaLocation W28923330541 @default.
• W2892333054 hasConcept C101271287 @default.
• W2892333054 hasConcept C119599485 @default.
• W2892333054 hasConcept C121332964 @default.
• W2892333054 hasConcept C127413603 @default.
• W2892333054 hasConcept C138331895 @default.
• W2892333054 hasConcept C146978453 @default.
• W2892333054 hasConcept C151730666 @default.
• W2892333054 hasConcept C163258240 @default.
• W2892333054 hasConcept C171146098 @default.
• W2892333054 hasConcept C176666156 @default.
• W2892333054 hasConcept C186937647 @default.
• W2892333054 hasConcept C192562407 @default.
• W2892333054 hasConcept C2779343474 @default.
• W2892333054 hasConcept C41008148 @default.
• W2892333054 hasConcept C43214815 @default.
• W2892333054 hasConcept C49040817 @default.
• W2892333054 hasConcept C526921623 @default.
• W2892333054 hasConcept C61082081 @default.
• W2892333054 hasConcept C62520636 @default.
• W2892333054 hasConcept C78519656 @default.
• W2892333054 hasConcept C86803240 @default.
• W2892333054 hasConceptScore W2892333054C101271287 @default.
• W2892333054 hasConceptScore W2892333054C119599485 @default.
• W2892333054 hasConceptScore W2892333054C121332964 @default.
• W2892333054 hasConceptScore W2892333054C127413603 @default.
• W2892333054 hasConceptScore W2892333054C138331895 @default.
• W2892333054 hasConceptScore W2892333054C146978453 @default.
• W2892333054 hasConceptScore W2892333054C151730666 @default.
• W2892333054 hasConceptScore W2892333054C163258240 @default.
• W2892333054 hasConceptScore W2892333054C171146098 @default.
• W2892333054 hasConceptScore W2892333054C176666156 @default.
• W2892333054 hasConceptScore W2892333054C186937647 @default.
• W2892333054 hasConceptScore W2892333054C192562407 @default.
• W2892333054 hasConceptScore W2892333054C2779343474 @default.
• W2892333054 hasConceptScore W2892333054C41008148 @default.
• W2892333054 hasConceptScore W2892333054C43214815 @default.
• W2892333054 hasConceptScore W2892333054C49040817 @default.
• W2892333054 hasConceptScore W2892333054C526921623 @default.
• W2892333054 hasConceptScore W2892333054C61082081 @default.
• W2892333054 hasConceptScore W2892333054C62520636 @default.
• W2892333054 hasConceptScore W2892333054C78519656 @default.
• W2892333054 hasConceptScore W2892333054C86803240 @default.
• W2892333054 hasLocation W28923330541 @default.
• W2892333054 hasLocation W28923330542 @default.
• W2892333054 hasOpenAccess W2892333054 @default.
• W2892333054 hasPrimaryLocation W28923330541 @default.
• W2892333054 hasRelatedWork W1970086259 @default.
• W2892333054 hasRelatedWork W2002758236 @default.

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