Matches in SemOpenAlex for { <https://semopenalex.org/work/W2893878515> ?p ?o ?g. }
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- W2893878515 endingPage "188" @default.
- W2893878515 startingPage "181" @default.
- W2893878515 abstract "In this paper, a high-thermoresistant temporary bonding/debonding system using spin-on glass (SOG) and hydrogenated amorphous silicon layers is proposed for the multichip-to-wafer (MCtW) 3-D integration based on a via-last/backside-via through-silicon via (TSV) approach. The shear strengths of chips bonded to wafers through the SOG layers are evaluated. In addition, the debonding performance of the chips from the wafers is investigated by using the KrF excimer laser irradiation. Finally, a via-last/backside-via MCtW 3-D integration process using the temporary bonding/debonding system is demonstrated to show the high feasibility with the successful interconnect formation of a Cu-TSVs daisy chain (10 $mu text{m}$ in diameter and 50 $mu text{m}$ in depth) with a SiO2 liner dielectric deposited by O3-tetraethylorthosilicate chemical vapor deposition at 350 °C." @default.
- W2893878515 created "2018-10-05" @default.
- W2893878515 creator A5006295728 @default.
- W2893878515 creator A5006321524 @default.
- W2893878515 creator A5014073992 @default.
- W2893878515 creator A5016129994 @default.
- W2893878515 creator A5036200957 @default.
- W2893878515 creator A5059487693 @default.
- W2893878515 date "2019-01-01" @default.
- W2893878515 modified "2023-09-24" @default.
- W2893878515 title "High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs" @default.
- W2893878515 cites W1971966678 @default.
- W2893878515 cites W1979601109 @default.
- W2893878515 cites W1986871080 @default.
- W2893878515 cites W1997935435 @default.
- W2893878515 cites W2009195513 @default.
- W2893878515 cites W2015091109 @default.
- W2893878515 cites W2016077759 @default.
- W2893878515 cites W2029530099 @default.
- W2893878515 cites W2044971431 @default.
- W2893878515 cites W2055355777 @default.
- W2893878515 cites W2061624187 @default.
- W2893878515 cites W2063114735 @default.
- W2893878515 cites W2077482887 @default.
- W2893878515 cites W2104878472 @default.
- W2893878515 cites W2120320030 @default.
- W2893878515 cites W2121681307 @default.
- W2893878515 cites W2127258915 @default.
- W2893878515 cites W2151613126 @default.
- W2893878515 cites W2169582528 @default.
- W2893878515 cites W2169624714 @default.
- W2893878515 cites W2518397625 @default.
- W2893878515 cites W2538379839 @default.
- W2893878515 cites W2541409995 @default.
- W2893878515 cites W2745270624 @default.
- W2893878515 cites W2767528953 @default.
- W2893878515 doi "https://doi.org/10.1109/tcpmt.2018.2871764" @default.
- W2893878515 hasPublicationYear "2019" @default.
- W2893878515 type Work @default.
- W2893878515 sameAs 2893878515 @default.
- W2893878515 citedByCount "3" @default.
- W2893878515 countsByYear W28938785152020 @default.
- W2893878515 countsByYear W28938785152022 @default.
- W2893878515 crossrefType "journal-article" @default.
- W2893878515 hasAuthorship W2893878515A5006295728 @default.
- W2893878515 hasAuthorship W2893878515A5006321524 @default.
- W2893878515 hasAuthorship W2893878515A5014073992 @default.
- W2893878515 hasAuthorship W2893878515A5016129994 @default.
- W2893878515 hasAuthorship W2893878515A5036200957 @default.
- W2893878515 hasAuthorship W2893878515A5059487693 @default.
- W2893878515 hasConcept C127413603 @default.
- W2893878515 hasConcept C149635348 @default.
- W2893878515 hasConcept C160671074 @default.
- W2893878515 hasConcept C192562407 @default.
- W2893878515 hasConcept C24326235 @default.
- W2893878515 hasConcept C2778638305 @default.
- W2893878515 hasConcept C2779133538 @default.
- W2893878515 hasConcept C41008148 @default.
- W2893878515 hasConcept C49040817 @default.
- W2893878515 hasConcept C61696701 @default.
- W2893878515 hasConcept C78519656 @default.
- W2893878515 hasConceptScore W2893878515C127413603 @default.
- W2893878515 hasConceptScore W2893878515C149635348 @default.
- W2893878515 hasConceptScore W2893878515C160671074 @default.
- W2893878515 hasConceptScore W2893878515C192562407 @default.
- W2893878515 hasConceptScore W2893878515C24326235 @default.
- W2893878515 hasConceptScore W2893878515C2778638305 @default.
- W2893878515 hasConceptScore W2893878515C2779133538 @default.
- W2893878515 hasConceptScore W2893878515C41008148 @default.
- W2893878515 hasConceptScore W2893878515C49040817 @default.
- W2893878515 hasConceptScore W2893878515C61696701 @default.
- W2893878515 hasConceptScore W2893878515C78519656 @default.
- W2893878515 hasFunder F4320323584 @default.
- W2893878515 hasIssue "1" @default.
- W2893878515 hasLocation W28938785151 @default.
- W2893878515 hasOpenAccess W2893878515 @default.
- W2893878515 hasPrimaryLocation W28938785151 @default.
- W2893878515 hasRelatedWork W1921746710 @default.
- W2893878515 hasRelatedWork W1959046692 @default.
- W2893878515 hasRelatedWork W1973473696 @default.
- W2893878515 hasRelatedWork W1997984059 @default.
- W2893878515 hasRelatedWork W2034671027 @default.
- W2893878515 hasRelatedWork W2052461205 @default.
- W2893878515 hasRelatedWork W2113107899 @default.
- W2893878515 hasRelatedWork W2127455146 @default.
- W2893878515 hasRelatedWork W2467481148 @default.
- W2893878515 hasRelatedWork W2108480527 @default.
- W2893878515 hasVolume "9" @default.
- W2893878515 isParatext "false" @default.
- W2893878515 isRetracted "false" @default.
- W2893878515 magId "2893878515" @default.
- W2893878515 workType "article" @default.