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- W2894085887 abstract "Toshiba has developed solid insulated switchgear (SIS), which insulates the main circuit with epoxy composites. The solid insulating system is able not only to use no SF6, which is a kind of global warming gas, but also to supply compact equipment. In SIS, heat generated by the current loss in the conductors is dissipated through the epoxy composite. Therefore, development of high thermal conductive epoxy composites has been desired with respect to large current class SIS such as 2500 A. In this article, epoxy composite was filled with MgO having high thermal conductivity and SiO2 having low thermal expansion coefficient. The result of temperature rise analysis of 40.5 kV–2500 A SIS demonstrated that the high thermal conductive epoxy composite reduced rising temperature by approximately 10 K compared to conventional epoxy composite." @default.
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- W2894085887 date "2018-09-23" @default.
- W2894085887 modified "2023-10-14" @default.
- W2894085887 title "Development of high thermal conductive epoxy composite for large current switchgear" @default.
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- W2894085887 doi "https://doi.org/10.1002/eej.23155" @default.
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