Matches in SemOpenAlex for { <https://semopenalex.org/work/W2894748495> ?p ?o ?g. }
Showing items 1 to 67 of
67
with 100 items per page.
- W2894748495 abstract "The aging and electromigration (EM) effects were evaluated when up to 0.19 wt.% Zn was added to Sn-0.7 wt.% Cu solder. Currently, the Sn-0.7 wt.% Cu solder is being widely used in the electronic industries due to its advantages of low cost and high temperature applications. However, its usage is also limited by detrimental properties – for instance, when compared to SAC305, Sn-0.7 wt.% Cu solder has lower electromigration life time, shear strength and drop reliability. Minor Zn alloying to Pb-free solders reportedly enhances some of their properties, e.g.: stabilization of bulk microstructures by decreasing undercooling; formation of a thin interfacial diffusion barrier and, thereby, suppressing Cu3Sn and Cu6Sn5 interfacial IMC growth rate and retarding under bump metallurgy (UBM) diffusion through the solder; and also, compensation for Sn self-diffusion due to reverse polarity effect.In this research, the aging and EM effects are assessed when 0.09, 0.16 and 0.19 wt.% Zn were added to Sn-0.7 wt.% Cu solder. The samples underwent up to 500 h of isothermal aging at temperatures of 125, 150 and 175 °C, and EM samples underwent up to 200 h of stressing at a constant temperature of 150 °C and current of 3.25 A. Solder balls were fabricated on a BGA structure for the aging tests, and for the EM tests, a pair of solders was assembled in a daisy-chain structure with organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG) surface finishes. The microstructural evolution and compositional distribution analyses were carried out using optical microscope with brightfield and cross polarized light, scanning electron microscope (SEM), energy dispersive spectrometer (EDS), electron probe micro analyzer (EPMA), and electron backscattered diffraction (EBSD). The addition of Zn suppresses the formation of Cu3Sn IMC and the total interfacial IMC thickness upon aging, and the samples with ENIG had smaller IMC thickness than OSP surface finish. In addition, the grains' microstructure becomes less interlaced and more stable, indicating lower undercooling. The electromigration effects on the microstructure is mainly governed by the relative orientation between the c-axis of Sn grains and the direction of current flow. When parallel, allows cathode UBM and alloying elements diffusion through the solder and formation of IMC, and, when transverse, inhibits this diffusion leading to failure by void formation at the anode UBM/solder interface due to depletion of the UBM and slow Sn self-diffusion." @default.
- W2894748495 created "2018-10-12" @default.
- W2894748495 creator A5046238817 @default.
- W2894748495 date "2018-01-16" @default.
- W2894748495 modified "2023-09-27" @default.
- W2894748495 title "Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration" @default.
- W2894748495 hasPublicationYear "2018" @default.
- W2894748495 type Work @default.
- W2894748495 sameAs 2894748495 @default.
- W2894748495 citedByCount "0" @default.
- W2894748495 crossrefType "dissertation" @default.
- W2894748495 hasAuthorship W2894748495A5046238817 @default.
- W2894748495 hasConcept C121332964 @default.
- W2894748495 hasConcept C133347239 @default.
- W2894748495 hasConcept C138055206 @default.
- W2894748495 hasConcept C159985019 @default.
- W2894748495 hasConcept C191897082 @default.
- W2894748495 hasConcept C192562407 @default.
- W2894748495 hasConcept C2778115343 @default.
- W2894748495 hasConcept C2778836790 @default.
- W2894748495 hasConcept C2779227376 @default.
- W2894748495 hasConcept C50296614 @default.
- W2894748495 hasConcept C69357855 @default.
- W2894748495 hasConcept C87976508 @default.
- W2894748495 hasConcept C94709252 @default.
- W2894748495 hasConcept C97355855 @default.
- W2894748495 hasConceptScore W2894748495C121332964 @default.
- W2894748495 hasConceptScore W2894748495C133347239 @default.
- W2894748495 hasConceptScore W2894748495C138055206 @default.
- W2894748495 hasConceptScore W2894748495C159985019 @default.
- W2894748495 hasConceptScore W2894748495C191897082 @default.
- W2894748495 hasConceptScore W2894748495C192562407 @default.
- W2894748495 hasConceptScore W2894748495C2778115343 @default.
- W2894748495 hasConceptScore W2894748495C2778836790 @default.
- W2894748495 hasConceptScore W2894748495C2779227376 @default.
- W2894748495 hasConceptScore W2894748495C50296614 @default.
- W2894748495 hasConceptScore W2894748495C69357855 @default.
- W2894748495 hasConceptScore W2894748495C87976508 @default.
- W2894748495 hasConceptScore W2894748495C94709252 @default.
- W2894748495 hasConceptScore W2894748495C97355855 @default.
- W2894748495 hasLocation W28947484951 @default.
- W2894748495 hasOpenAccess W2894748495 @default.
- W2894748495 hasPrimaryLocation W28947484951 @default.
- W2894748495 hasRelatedWork W164748078 @default.
- W2894748495 hasRelatedWork W1966113167 @default.
- W2894748495 hasRelatedWork W2035663776 @default.
- W2894748495 hasRelatedWork W2049979369 @default.
- W2894748495 hasRelatedWork W2083193163 @default.
- W2894748495 hasRelatedWork W2140398932 @default.
- W2894748495 hasRelatedWork W2310460670 @default.
- W2894748495 hasRelatedWork W2359291806 @default.
- W2894748495 hasRelatedWork W2384022881 @default.
- W2894748495 hasRelatedWork W240625628 @default.
- W2894748495 hasRelatedWork W2461245763 @default.
- W2894748495 hasRelatedWork W2759624120 @default.
- W2894748495 hasRelatedWork W2767122650 @default.
- W2894748495 hasRelatedWork W2802978336 @default.
- W2894748495 hasRelatedWork W2804598471 @default.
- W2894748495 hasRelatedWork W2948288340 @default.
- W2894748495 hasRelatedWork W2968025501 @default.
- W2894748495 hasRelatedWork W3135009854 @default.
- W2894748495 hasRelatedWork W3210384154 @default.
- W2894748495 hasRelatedWork W3444318 @default.
- W2894748495 isParatext "false" @default.
- W2894748495 isRetracted "false" @default.
- W2894748495 magId "2894748495" @default.
- W2894748495 workType "dissertation" @default.