Matches in SemOpenAlex for { <https://semopenalex.org/work/W2894831385> ?p ?o ?g. }
- W2894831385 endingPage "175" @default.
- W2894831385 startingPage "163" @default.
- W2894831385 abstract "Functional materials for flexible and wearable smart devices have attracted much attention in recent years. This paper describes structure and properties of uniquely prepared, functional interconnectable nanoparticles (NPs) of Cu6Sn5 intermetallic compound that can allow 3D flexible packaging and nano-circuits. In situ TEM analysis confirms that size-controllable Cu6Sn5 NPs as small as ∼6.40 nm can be made sinterable at the start temperature as low as ∼130 °C, which is much lower than its bulk melting point (MP) of 415 °C. After sintering, its high MP provides mechanical and thermal stability. Based on the in situ TEM observation and calculation, particle size and distribution affects the sintering process. More interestingly, the relative orientations of adjacent particles also play an important role. A new orientation related sintering mechanism noted as orientation unification (OU) is revealed as two adjacent particles exhibit orientation change to slowly match their orientation with each other during the heating process. The interesting interaction between nano-Cu6Sn5 and micro-Cu substrate during in situ TEM heating gives first hand atomic level proof of the formation of Cu3Sn. The nano-Cu6Sn5 joints possess high enough bonding strength and great high temperature working capability. This intermetallic nano-soldering approach can pioneer a novel strategy of circuit connection, by providing high working temperature interconnection materials for 3D flexible packaging and ultra-high-density micro/nano interconnections." @default.
- W2894831385 created "2018-10-12" @default.
- W2894831385 creator A5014006245 @default.
- W2894831385 creator A5016026704 @default.
- W2894831385 creator A5020290769 @default.
- W2894831385 creator A5053347964 @default.
- W2894831385 date "2019-01-01" @default.
- W2894831385 modified "2023-10-18" @default.
- W2894831385 title "Low-temperature-solderable intermetallic nanoparticles for 3D printable flexible electronics" @default.
- W2894831385 cites W1496001241 @default.
- W2894831385 cites W1504687253 @default.
- W2894831385 cites W189803804 @default.
- W2894831385 cites W1914161673 @default.
- W2894831385 cites W1976696146 @default.
- W2894831385 cites W1986035654 @default.
- W2894831385 cites W1994763658 @default.
- W2894831385 cites W1995079005 @default.
- W2894831385 cites W1997601136 @default.
- W2894831385 cites W1998544072 @default.
- W2894831385 cites W2001562953 @default.
- W2894831385 cites W2016464593 @default.
- W2894831385 cites W2027708390 @default.
- W2894831385 cites W2029135951 @default.
- W2894831385 cites W2033515476 @default.
- W2894831385 cites W2040786093 @default.
- W2894831385 cites W2046181975 @default.
- W2894831385 cites W2055464044 @default.
- W2894831385 cites W2077028552 @default.
- W2894831385 cites W2078010004 @default.
- W2894831385 cites W2082732411 @default.
- W2894831385 cites W2085015653 @default.
- W2894831385 cites W2092603888 @default.
- W2894831385 cites W2114721754 @default.
- W2894831385 cites W2133562203 @default.
- W2894831385 cites W2157426451 @default.
- W2894831385 cites W2158343197 @default.
- W2894831385 cites W2210712149 @default.
- W2894831385 cites W2266175888 @default.
- W2894831385 cites W2285847257 @default.
- W2894831385 cites W2314318326 @default.
- W2894831385 cites W2317998301 @default.
- W2894831385 cites W2320638497 @default.
- W2894831385 cites W2326241140 @default.
- W2894831385 cites W2430072370 @default.
- W2894831385 cites W2460534603 @default.
- W2894831385 cites W2470344446 @default.
- W2894831385 cites W2512400075 @default.
- W2894831385 cites W2553947284 @default.
- W2894831385 cites W2576308337 @default.
- W2894831385 cites W2737405491 @default.
- W2894831385 cites W2749804493 @default.
- W2894831385 cites W2799893850 @default.
- W2894831385 doi "https://doi.org/10.1016/j.actamat.2018.09.069" @default.
- W2894831385 hasPublicationYear "2019" @default.
- W2894831385 type Work @default.
- W2894831385 sameAs 2894831385 @default.
- W2894831385 citedByCount "25" @default.
- W2894831385 countsByYear W28948313852019 @default.
- W2894831385 countsByYear W28948313852020 @default.
- W2894831385 countsByYear W28948313852021 @default.
- W2894831385 countsByYear W28948313852022 @default.
- W2894831385 countsByYear W28948313852023 @default.
- W2894831385 crossrefType "journal-article" @default.
- W2894831385 hasAuthorship W2894831385A5014006245 @default.
- W2894831385 hasAuthorship W2894831385A5016026704 @default.
- W2894831385 hasAuthorship W2894831385A5020290769 @default.
- W2894831385 hasAuthorship W2894831385A5053347964 @default.
- W2894831385 hasConcept C111368507 @default.
- W2894831385 hasConcept C123745756 @default.
- W2894831385 hasConcept C127313418 @default.
- W2894831385 hasConcept C155672457 @default.
- W2894831385 hasConcept C159985019 @default.
- W2894831385 hasConcept C171250308 @default.
- W2894831385 hasConcept C192562407 @default.
- W2894831385 hasConcept C27501479 @default.
- W2894831385 hasConcept C2777289219 @default.
- W2894831385 hasConcept C2777581544 @default.
- W2894831385 hasConcept C2780026712 @default.
- W2894831385 hasConcept C31258907 @default.
- W2894831385 hasConcept C41008148 @default.
- W2894831385 hasConcept C50296614 @default.
- W2894831385 hasConceptScore W2894831385C111368507 @default.
- W2894831385 hasConceptScore W2894831385C123745756 @default.
- W2894831385 hasConceptScore W2894831385C127313418 @default.
- W2894831385 hasConceptScore W2894831385C155672457 @default.
- W2894831385 hasConceptScore W2894831385C159985019 @default.
- W2894831385 hasConceptScore W2894831385C171250308 @default.
- W2894831385 hasConceptScore W2894831385C192562407 @default.
- W2894831385 hasConceptScore W2894831385C27501479 @default.
- W2894831385 hasConceptScore W2894831385C2777289219 @default.
- W2894831385 hasConceptScore W2894831385C2777581544 @default.
- W2894831385 hasConceptScore W2894831385C2780026712 @default.
- W2894831385 hasConceptScore W2894831385C31258907 @default.
- W2894831385 hasConceptScore W2894831385C41008148 @default.
- W2894831385 hasConceptScore W2894831385C50296614 @default.
- W2894831385 hasFunder F4320321001 @default.
- W2894831385 hasLocation W28948313851 @default.
- W2894831385 hasOpenAccess W2894831385 @default.