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- W2894899336 abstract "Abstract Optical elements will go through grinding, lapping and polishing to reach the final accuracy, and large amount of time is consumed between grinding and polishing in order to remove cracks and defects left by grinding. This manuscript tries to employ HF etching process into the manufacturing of fused silica optical elements to improve the efficiency and quality, so the concentrated HF etching process of fused silica was studied systematically. Firstly, the principle of HF etching fused silica is introduced. Then, the process of concentrated HF is studied, which shows that the etching rate of concentrated HF is as high as 1.14 μm/min and the surface shape of workpiece can be basically kept unchanged after etching. Finally, the observation results of fused silica samples processed by concentrated HF show that the concentrated HF processing can eliminate the cracks on the surface left by grinding and improve the roughness of the surface. So the concentrated HF etching can be used to process the fused silica sample after grinding, it will eliminate cracks and defects quickly, improve the surface quality of the component, and promote the subsequent polishing process." @default.
- W2894899336 created "2018-10-12" @default.
- W2894899336 creator A5004780361 @default.
- W2894899336 date "2019-02-01" @default.
- W2894899336 modified "2023-09-29" @default.
- W2894899336 title "Study on etching process of fused silica with concentrated HF" @default.
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- W2894899336 doi "https://doi.org/10.1016/j.ijleo.2018.10.011" @default.
- W2894899336 hasPublicationYear "2019" @default.
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