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• W2894932162 abstract "Abstract In this paper, copper nanofluid was prepared through one-step method with ethylene glycol (EG) as base fluid for a low particle loading range of 0.03-0.12 vol. % using PVP (Polyvinylpyrrolidone) as surfactant. Sodium hypophosphite was used to reduce the copper sulphate pentahydrate salt. The amount of PVP was kept constant to examine the effects of stability on the thermal conductivity of the prepared nanofluid. At room temperature, a maximum of 9.4% and at 50°C an enhancement of 18% in thermal conductivity was achieved. The stability and viscosity of the prepared samples were analysed using spectrophotometer and Rheometer respectively." @default.
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• W2894932162 date "2018-01-01" @default.
• W2894932162 modified "2023-09-25" @default.
• W2894932162 title "The effect of stability on the thermal conductivity of copper nanofluid at low particle loadings" @default.
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• W2894932162 doi "https://doi.org/10.1016/j.matpr.2018.06.448" @default.
• W2894932162 hasPublicationYear "2018" @default.
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