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- W2895780519 abstract "Fully functional pyroelectric films are fabricated on a silicon substrate with deep-trench structures, for the first time. Future integrated pyroelectric applications such as infrared sensors, energy harvesters or temperature manipulation devices require large current responses at low device footprints. In this work, pyroelectric Si-doped HfO <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> is deposited in trench structures to considerably increase the pyroelectric response, yielding a coefficient of p = -1560 μC/m <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> K, which is four times larger than that of PZT projected to the device area. A large harvestable energy density of F <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>E</sub> = 542 J/m <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</sup> K <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> is measured. Simultaneously, CMOS compatible and RoHS compliant manufacturing is demonstrated. Metalorganic atomic layer deposition (ALD) is used to coat the 1:16 aspect ratio structures conformally with uniform silicon dopant levels." @default.
- W2895780519 created "2018-10-26" @default.
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- W2895780519 date "2018-09-01" @default.
- W2895780519 modified "2023-09-26" @default.
- W2895780519 title "CMOS Compatible Pyroelectric Applications Enabled by Doped HfO<inf>2</inf> Films on Deep-Trench Structures" @default.
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- W2895780519 doi "https://doi.org/10.1109/essderc.2018.8486864" @default.
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