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- W2895816504 abstract "Abstract Graphene reinforced Cu matrix composite was fabricated by consolidating mechanically mixed powder blend to 98% theoretical density by High Pressure Torsion (HPT). Microstructural characterization by scanning electron microscopy (SEM) elicits even distribution of the reinforcement phase into the matrix. X-ray diffraction (XRD) and transmission electron microscopy (TEM) confirms nanocrystalline microstructure and strong interfacial bonding between Cu and graphene. Addition of 10 wt % graphene yields maximum hardness (∼2.67 GPa) and Young's modulus (∼102.03 GPa). The increment in strength was attributed to the microstructural refinement and dislocation pinning at the strong matrix-reinforcement interface. The electrical conductivity of the Cu- 10 wt% graphene composite was found to be ∼87% IACS. Results indicated that HPT consolidation is an efficient mean for synthesizing Cu-graphene composite with improved strength (∼2 times higher hardness than pure Cu processed under similar condition) with negotiable conductivity." @default.
- W2895816504 created "2018-10-26" @default.
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- W2895816504 date "2019-03-01" @default.
- W2895816504 modified "2023-10-04" @default.
- W2895816504 title "Mechanical and electrical properties of copper-graphene nanocomposite fabricated by high pressure torsion" @default.
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- W2895816504 doi "https://doi.org/10.1016/j.jallcom.2018.10.139" @default.
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