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- W2895920022 abstract "In this paper, some potential influencing factors of the TSV (Through Silicon Via) interposer were analyzed in high frequency bands from 10 GHz to 50 GHz by HFSS software. An interposer model with QFN (Quad Flat No-lead Package)-BGA (Ball Grid Array) transmission structure was designed to investigate the influence of the parameters such as shape, distance of BGA solder joint and TSV. In the model, TSV was used to connect QFN pad and BGA balls to transmit signal. According to the simulation results, the shape and distance of BGA balls significantly affect the RF transmission performance. A cylinder-shape BGA solder joint has better performance. In addition, the radius, distance and shape of TSV have obvious influence on the transmission performance of the interposer in the relative high frequency bands. The T-shape of TSV, short distance between RF TSV and GND TSV are both weak influencing factors." @default.
- W2895920022 created "2018-10-26" @default.
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- W2895920022 date "2018-08-01" @default.
- W2895920022 modified "2023-09-30" @default.
- W2895920022 title "Analysis of RF transmission performance of 3D TSV interposer" @default.
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- W2895920022 doi "https://doi.org/10.1109/icept.2018.8480521" @default.
- W2895920022 hasPublicationYear "2018" @default.
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