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- W2895982095 abstract "Laser marking of silicon wafers has been an industrial standard for many years. Up until 1998, wafer marking was just for identification at wafer level. Initially driven by the Known Good Die (K.G.D), and more recently by traceability and component identification, laser marking on the backside of the wafer at die level has become the trend. It affects various packaging technologies, including MCM, Flip Chip, DCA, and CSP. For the past years, research and development effort has been given to develop such a marking tool for production. In this paper, we present the technical results of such an effort." @default.
- W2895982095 created "2018-10-26" @default.
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- W2895982095 date "2003-01-01" @default.
- W2895982095 modified "2023-10-18" @default.
- W2895982095 title "Laser wafer marking at die level" @default.
- W2895982095 doi "https://doi.org/10.2351/1.5060126" @default.
- W2895982095 hasPublicationYear "2003" @default.
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