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- W2896443709 abstract "At current industrial sites for the manufacturing of fabricated metal products, a complete nondestructive, noncontact inspection of the residual stress and hardness is required. However, the conventional Debye-ring measurement system is used only for sampling inspection or research because the measurement time is long. Therefore, we have developed a high-speed Debye-ring measurement system using an integration-type silicon-on-insulator (SOI) pixel detector (INTPIX4) that can evaluate material characteristics for industrial purposes. The INTPIX4 is an X-ray imager with 832 × 512 pixels, where the size of each pixel is 17μm x 17μm. By using an SOI evaluation board with SiTCP 2 (SEABAS2), it is possible to measure Debye-rings up to 45 times in 1 s. The developed system is a compact and high-speed Debye-ring measurement system that uses two INTPIX4 detectors and a compact high-power X-ray tube. We evaluate the performance of the system." @default.
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- W2896443709 date "2019-04-01" @default.
- W2896443709 modified "2023-10-04" @default.
- W2896443709 title "Development of Debye-ring measurement system using SOI pixel detector" @default.
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- W2896443709 doi "https://doi.org/10.1016/j.nima.2018.09.147" @default.
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