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- W2896473906 abstract "The purpose of the research reported here was to obtain laser dicing of silicon wafers without deposition of ablated particles. This was done by using micro-drops of water in laser ablation process. The micro-drops of water 70 µm in diameter used in these experiments were made by a micro-nozzle with a piezoelectric actuator. Micro-drops were continuously put on a silicon wafer moving at a constant speed while the wafer was irradiated with laser pulses (wavelength of 532 nm) reaching the wafer surface through the micro-drops. Using micro-drop reduced the deposition of ablated particles. The form of the ablated part strongly depends on the surface condition of the substrate and the delay time between the micro-drop and the laser pulse. This result indicates that the laser ablation using 180-pl micro-drops of water produces the same effect as underwater laser ablation. A flexural stress as much as 720 MPa was measured. This stress is close to that generated when a blade is used for dicing.The purpose of the research reported here was to obtain laser dicing of silicon wafers without deposition of ablated particles. This was done by using micro-drops of water in laser ablation process. The micro-drops of water 70 µm in diameter used in these experiments were made by a micro-nozzle with a piezoelectric actuator. Micro-drops were continuously put on a silicon wafer moving at a constant speed while the wafer was irradiated with laser pulses (wavelength of 532 nm) reaching the wafer surface through the micro-drops. Using micro-drop reduced the deposition of ablated particles. The form of the ablated part strongly depends on the surface condition of the substrate and the delay time between the micro-drop and the laser pulse. This result indicates that the laser ablation using 180-pl micro-drops of water produces the same effect as underwater laser ablation. A flexural stress as much as 720 MPa was measured. This stress is close to that generated when a blade is used for dicing." @default.
- W2896473906 created "2018-10-26" @default.
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- W2896473906 date "2004-01-01" @default.
- W2896473906 modified "2023-09-27" @default.
- W2896473906 title "Laser ablation with water micro-drop for dicing of silicon wafer" @default.
- W2896473906 doi "https://doi.org/10.2351/1.5060327" @default.
- W2896473906 hasPublicationYear "2004" @default.
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