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- W2896490509 abstract "Through-silicon via is now widely used in MEMS (Micro Mechanical Electrical System) packaging products and its thermal-mechanical reliability is still a critical problem that needs further optimization. Finite element modeling is an effective technique to evaluate thermal-mechanical reliability of 3D-TSV (Three-Dimensional Through-Silicon Via) MEMS products and to optimize their geometric parameters or materials selection. In this work, we proposed a processes- based multistep simulation method, which includes steps of LPCVD (Low-Pressure Chemical Vapor Deposition) SiO2, Cu/Sn microbumps bonding, annealing, reflow and thermal cycles. In the step of Cu/Sn microbumps bonding, an external bonding force 5 MPa and a modified boundary condition were adopted to get more accurate simulation results. It was found that worse stress condition could be induced due to higher processes temperature of Cu/Sn microbumps bonding, annealing and reflow. Comparison of shear stress at the interface of the Cu/Sn bonded seal ring and the MEMS chip inferred that one-step model simulation leads to more than 35% deviation. An overestimated fatigue life of solder balls was obtained by one-step model." @default.
- W2896490509 created "2018-10-26" @default.
- W2896490509 creator A5025811950 @default.
- W2896490509 creator A5048379858 @default.
- W2896490509 creator A5078058401 @default.
- W2896490509 date "2018-08-01" @default.
- W2896490509 modified "2023-10-16" @default.
- W2896490509 title "Processes-based Multistep Simulation of Thermal- mechanical Reliability of a 3D-TSV MEMS" @default.
- W2896490509 cites W1964046485 @default.
- W2896490509 cites W2035296778 @default.
- W2896490509 cites W2041507274 @default.
- W2896490509 cites W2050000080 @default.
- W2896490509 cites W2127210483 @default.
- W2896490509 cites W2143926454 @default.
- W2896490509 cites W2513809753 @default.
- W2896490509 cites W2623014902 @default.
- W2896490509 doi "https://doi.org/10.1109/icept.2018.8480793" @default.
- W2896490509 hasPublicationYear "2018" @default.
- W2896490509 type Work @default.
- W2896490509 sameAs 2896490509 @default.
- W2896490509 citedByCount "0" @default.
- W2896490509 crossrefType "proceedings-article" @default.
- W2896490509 hasAuthorship W2896490509A5025811950 @default.
- W2896490509 hasAuthorship W2896490509A5048379858 @default.
- W2896490509 hasAuthorship W2896490509A5078058401 @default.
- W2896490509 hasConcept C121332964 @default.
- W2896490509 hasConcept C127413603 @default.
- W2896490509 hasConcept C135628077 @default.
- W2896490509 hasConcept C138885662 @default.
- W2896490509 hasConcept C153294291 @default.
- W2896490509 hasConcept C159985019 @default.
- W2896490509 hasConcept C163258240 @default.
- W2896490509 hasConcept C192562407 @default.
- W2896490509 hasConcept C204530211 @default.
- W2896490509 hasConcept C21036866 @default.
- W2896490509 hasConcept C21141959 @default.
- W2896490509 hasConcept C2777855556 @default.
- W2896490509 hasConcept C37977207 @default.
- W2896490509 hasConcept C41895202 @default.
- W2896490509 hasConcept C43214815 @default.
- W2896490509 hasConcept C45632049 @default.
- W2896490509 hasConcept C49040817 @default.
- W2896490509 hasConcept C50296614 @default.
- W2896490509 hasConcept C530198007 @default.
- W2896490509 hasConcept C544956773 @default.
- W2896490509 hasConcept C57410435 @default.
- W2896490509 hasConcept C59088047 @default.
- W2896490509 hasConcept C62520636 @default.
- W2896490509 hasConcept C66938386 @default.
- W2896490509 hasConcept C78519656 @default.
- W2896490509 hasConceptScore W2896490509C121332964 @default.
- W2896490509 hasConceptScore W2896490509C127413603 @default.
- W2896490509 hasConceptScore W2896490509C135628077 @default.
- W2896490509 hasConceptScore W2896490509C138885662 @default.
- W2896490509 hasConceptScore W2896490509C153294291 @default.
- W2896490509 hasConceptScore W2896490509C159985019 @default.
- W2896490509 hasConceptScore W2896490509C163258240 @default.
- W2896490509 hasConceptScore W2896490509C192562407 @default.
- W2896490509 hasConceptScore W2896490509C204530211 @default.
- W2896490509 hasConceptScore W2896490509C21036866 @default.
- W2896490509 hasConceptScore W2896490509C21141959 @default.
- W2896490509 hasConceptScore W2896490509C2777855556 @default.
- W2896490509 hasConceptScore W2896490509C37977207 @default.
- W2896490509 hasConceptScore W2896490509C41895202 @default.
- W2896490509 hasConceptScore W2896490509C43214815 @default.
- W2896490509 hasConceptScore W2896490509C45632049 @default.
- W2896490509 hasConceptScore W2896490509C49040817 @default.
- W2896490509 hasConceptScore W2896490509C50296614 @default.
- W2896490509 hasConceptScore W2896490509C530198007 @default.
- W2896490509 hasConceptScore W2896490509C544956773 @default.
- W2896490509 hasConceptScore W2896490509C57410435 @default.
- W2896490509 hasConceptScore W2896490509C59088047 @default.
- W2896490509 hasConceptScore W2896490509C62520636 @default.
- W2896490509 hasConceptScore W2896490509C66938386 @default.
- W2896490509 hasConceptScore W2896490509C78519656 @default.
- W2896490509 hasLocation W28964905091 @default.
- W2896490509 hasOpenAccess W2896490509 @default.
- W2896490509 hasPrimaryLocation W28964905091 @default.
- W2896490509 hasRelatedWork W1588641326 @default.
- W2896490509 hasRelatedWork W2019002696 @default.
- W2896490509 hasRelatedWork W2035148151 @default.
- W2896490509 hasRelatedWork W2086451374 @default.
- W2896490509 hasRelatedWork W2161828806 @default.
- W2896490509 hasRelatedWork W2288221987 @default.
- W2896490509 hasRelatedWork W2513809753 @default.
- W2896490509 hasRelatedWork W2544384102 @default.
- W2896490509 hasRelatedWork W2896490509 @default.
- W2896490509 hasRelatedWork W3211017996 @default.
- W2896490509 isParatext "false" @default.
- W2896490509 isRetracted "false" @default.
- W2896490509 magId "2896490509" @default.
- W2896490509 workType "article" @default.