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- W2896651875 abstract "The simple theoretical model of laser plasma heating side walls in laser drilling high aspect ratio microvias in metals and semiconductors is proposed. On this basis the recommendations are given how to avoid the undesirable effect of laser plasma melting side walls, strongly deteriorating microdrilling quality. Obtained results constitute a physical foundation for development of optimized laser drilling and cutting. Particular estimations are given for laser drilling silicon wafers.The simple theoretical model of laser plasma heating side walls in laser drilling high aspect ratio microvias in metals and semiconductors is proposed. On this basis the recommendations are given how to avoid the undesirable effect of laser plasma melting side walls, strongly deteriorating microdrilling quality. Obtained results constitute a physical foundation for development of optimized laser drilling and cutting. Particular estimations are given for laser drilling silicon wafers." @default.
- W2896651875 created "2018-10-26" @default.
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- W2896651875 date "2010-01-01" @default.
- W2896651875 modified "2023-09-27" @default.
- W2896651875 title "Suppression of laser plasma melting side walls in laser drilling high aspect ratio microvias" @default.
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- W2896651875 doi "https://doi.org/10.2351/1.5062146" @default.
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