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- W2896694949 abstract "Through silicon via (TSV) is an important technology to realize three-dimensional (3D) packaging with lower energy consumption, faster signal transmission rate and smaller packaging size. Voids and seams are usually formed in the TSV filling process and an appropriate numerical model is needed to predict the filling process. A mathematical model is presented and verified by experiments. In the simulation, we found that as the suppressor concentration increases, the cupric ion in the microvias decreases more slowly with increasing microvias depth; the location of the peak of the accelerator surface coverage is further away from the orifice and the microvias can maintain a larger range of high suppressor surface coverage, resulting in a higher filling ratio. In addition, the presence of accelerators cannot change the distribution of cupric ions in the microvias and the suppressor surface coverage. Therefore, the filling ratio is not affected. But the presence of accelerators can greatly accelerate the cupric deposition rate." @default.
- W2896694949 created "2018-10-26" @default.
- W2896694949 creator A5003642180 @default.
- W2896694949 creator A5052511559 @default.
- W2896694949 creator A5063891035 @default.
- W2896694949 creator A5071037763 @default.
- W2896694949 date "2018-08-01" @default.
- W2896694949 modified "2023-10-17" @default.
- W2896694949 title "Mathematical simulation and experimental verification for through silicon via with additives" @default.
- W2896694949 cites W2002312857 @default.
- W2896694949 cites W2025296481 @default.
- W2896694949 cites W2063580786 @default.
- W2896694949 cites W2115117883 @default.
- W2896694949 cites W2119289729 @default.
- W2896694949 cites W2155044490 @default.
- W2896694949 cites W2293346908 @default.
- W2896694949 cites W2334212800 @default.
- W2896694949 cites W2523756697 @default.
- W2896694949 cites W2530680692 @default.
- W2896694949 cites W2556528087 @default.
- W2896694949 cites W2566780915 @default.
- W2896694949 cites W2580787844 @default.
- W2896694949 cites W2584506805 @default.
- W2896694949 cites W2620214892 @default.
- W2896694949 cites W2620632672 @default.
- W2896694949 doi "https://doi.org/10.1109/icept.2018.8480745" @default.
- W2896694949 hasPublicationYear "2018" @default.
- W2896694949 type Work @default.
- W2896694949 sameAs 2896694949 @default.
- W2896694949 citedByCount "0" @default.
- W2896694949 crossrefType "proceedings-article" @default.
- W2896694949 hasAuthorship W2896694949A5003642180 @default.
- W2896694949 hasAuthorship W2896694949A5052511559 @default.
- W2896694949 hasAuthorship W2896694949A5063891035 @default.
- W2896694949 hasAuthorship W2896694949A5071037763 @default.
- W2896694949 hasConcept C111919701 @default.
- W2896694949 hasConcept C116915560 @default.
- W2896694949 hasConcept C127413603 @default.
- W2896694949 hasConcept C145148216 @default.
- W2896694949 hasConcept C151730666 @default.
- W2896694949 hasConcept C159985019 @default.
- W2896694949 hasConcept C178790620 @default.
- W2896694949 hasConcept C185592680 @default.
- W2896694949 hasConcept C192562407 @default.
- W2896694949 hasConcept C194242075 @default.
- W2896694949 hasConcept C204323151 @default.
- W2896694949 hasConcept C2816523 @default.
- W2896694949 hasConcept C41008148 @default.
- W2896694949 hasConcept C45632049 @default.
- W2896694949 hasConcept C49040817 @default.
- W2896694949 hasConcept C544956773 @default.
- W2896694949 hasConcept C64297162 @default.
- W2896694949 hasConcept C78519656 @default.
- W2896694949 hasConcept C86803240 @default.
- W2896694949 hasConcept C98045186 @default.
- W2896694949 hasConceptScore W2896694949C111919701 @default.
- W2896694949 hasConceptScore W2896694949C116915560 @default.
- W2896694949 hasConceptScore W2896694949C127413603 @default.
- W2896694949 hasConceptScore W2896694949C145148216 @default.
- W2896694949 hasConceptScore W2896694949C151730666 @default.
- W2896694949 hasConceptScore W2896694949C159985019 @default.
- W2896694949 hasConceptScore W2896694949C178790620 @default.
- W2896694949 hasConceptScore W2896694949C185592680 @default.
- W2896694949 hasConceptScore W2896694949C192562407 @default.
- W2896694949 hasConceptScore W2896694949C194242075 @default.
- W2896694949 hasConceptScore W2896694949C204323151 @default.
- W2896694949 hasConceptScore W2896694949C2816523 @default.
- W2896694949 hasConceptScore W2896694949C41008148 @default.
- W2896694949 hasConceptScore W2896694949C45632049 @default.
- W2896694949 hasConceptScore W2896694949C49040817 @default.
- W2896694949 hasConceptScore W2896694949C544956773 @default.
- W2896694949 hasConceptScore W2896694949C64297162 @default.
- W2896694949 hasConceptScore W2896694949C78519656 @default.
- W2896694949 hasConceptScore W2896694949C86803240 @default.
- W2896694949 hasConceptScore W2896694949C98045186 @default.
- W2896694949 hasLocation W28966949491 @default.
- W2896694949 hasOpenAccess W2896694949 @default.
- W2896694949 hasPrimaryLocation W28966949491 @default.
- W2896694949 hasRelatedWork W198012751 @default.
- W2896694949 hasRelatedWork W1999276122 @default.
- W2896694949 hasRelatedWork W1999860072 @default.
- W2896694949 hasRelatedWork W2016737600 @default.
- W2896694949 hasRelatedWork W2053735234 @default.
- W2896694949 hasRelatedWork W2055535976 @default.
- W2896694949 hasRelatedWork W2094504637 @default.
- W2896694949 hasRelatedWork W2105737714 @default.
- W2896694949 hasRelatedWork W2155387998 @default.
- W2896694949 hasRelatedWork W3101130858 @default.
- W2896694949 isParatext "false" @default.
- W2896694949 isRetracted "false" @default.
- W2896694949 magId "2896694949" @default.
- W2896694949 workType "article" @default.