Matches in SemOpenAlex for { <https://semopenalex.org/work/W2896757621> ?p ?o ?g. }
Showing items 1 to 57 of
57
with 100 items per page.
- W2896757621 abstract "Fine pitch bumping is the key enabling technology to achieve vertical interconnect in electronic packaging and integration. Cu pillar bump with Cu/Ni/SnAg structure is the widely accepted bump scheme to achieve ideal bump electrical and mechanical performance. In this paper, we report our latest results on the 30 um pitch Cu pillar bump development. The critical process steps, including bump lithography, electroplating, seed layer etching, reflow, are investigated. Good Cu pillar bump profile in 30 um pitch is successfully achieved through the optimization of the process. A typical application using the developed bumping process has been demonstrated." @default.
- W2896757621 created "2018-10-26" @default.
- W2896757621 creator A5032150319 @default.
- W2896757621 creator A5043347603 @default.
- W2896757621 creator A5065162078 @default.
- W2896757621 creator A5083314215 @default.
- W2896757621 creator A5087650455 @default.
- W2896757621 date "2018-08-01" @default.
- W2896757621 modified "2023-09-26" @default.
- W2896757621 title "Process Development of Ultra-Fine Pitch High Density Micro Bumps" @default.
- W2896757621 cites W1976112226 @default.
- W2896757621 cites W2022483435 @default.
- W2896757621 cites W2024397857 @default.
- W2896757621 cites W2083252258 @default.
- W2896757621 cites W2084477598 @default.
- W2896757621 cites W2134972649 @default.
- W2896757621 cites W2160090327 @default.
- W2896757621 doi "https://doi.org/10.1109/icept.2018.8480629" @default.
- W2896757621 hasPublicationYear "2018" @default.
- W2896757621 type Work @default.
- W2896757621 sameAs 2896757621 @default.
- W2896757621 citedByCount "2" @default.
- W2896757621 countsByYear W28967576212021 @default.
- W2896757621 countsByYear W28967576212023 @default.
- W2896757621 crossrefType "proceedings-article" @default.
- W2896757621 hasAuthorship W2896757621A5032150319 @default.
- W2896757621 hasAuthorship W2896757621A5043347603 @default.
- W2896757621 hasAuthorship W2896757621A5065162078 @default.
- W2896757621 hasAuthorship W2896757621A5083314215 @default.
- W2896757621 hasAuthorship W2896757621A5087650455 @default.
- W2896757621 hasConcept C111919701 @default.
- W2896757621 hasConcept C192562407 @default.
- W2896757621 hasConcept C41008148 @default.
- W2896757621 hasConcept C49040817 @default.
- W2896757621 hasConcept C98045186 @default.
- W2896757621 hasConceptScore W2896757621C111919701 @default.
- W2896757621 hasConceptScore W2896757621C192562407 @default.
- W2896757621 hasConceptScore W2896757621C41008148 @default.
- W2896757621 hasConceptScore W2896757621C49040817 @default.
- W2896757621 hasConceptScore W2896757621C98045186 @default.
- W2896757621 hasLocation W28967576211 @default.
- W2896757621 hasOpenAccess W2896757621 @default.
- W2896757621 hasPrimaryLocation W28967576211 @default.
- W2896757621 hasRelatedWork W2058676402 @default.
- W2896757621 hasRelatedWork W2059363835 @default.
- W2896757621 hasRelatedWork W2139871202 @default.
- W2896757621 hasRelatedWork W2292675962 @default.
- W2896757621 hasRelatedWork W2329285141 @default.
- W2896757621 hasRelatedWork W2399397734 @default.
- W2896757621 hasRelatedWork W2769410768 @default.
- W2896757621 hasRelatedWork W2899084033 @default.
- W2896757621 hasRelatedWork W2902546961 @default.
- W2896757621 hasRelatedWork W4296250578 @default.
- W2896757621 isParatext "false" @default.
- W2896757621 isRetracted "false" @default.
- W2896757621 magId "2896757621" @default.
- W2896757621 workType "article" @default.