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- W2896810513 abstract "To verify the interaction of non-uniform power joule heat and temperature on chip, the electrical-thermal co- simulation is applied for low-profile fine-pitch ball grid array(LFBGA). Based on ANSYS Siwave, the power dissipation is simulated firstly. Similarly, temperature is simulated in ANSYS Icepak. By using the data interface between Siwave and Icepak, the two-way coupling can be accomplished. Thermal resistance is used to estimate the heat dissipation capability. According to comparing the results, the non-uniform joule heat and temperature are rising simultaneously." @default.
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- W2896810513 date "2018-08-01" @default.
- W2896810513 modified "2023-09-27" @default.
- W2896810513 title "Electrical-Thermal Co-Simulation for LFBGA" @default.
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- W2896810513 doi "https://doi.org/10.1109/icept.2018.8480709" @default.
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