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- W2896937875 abstract "The slide presentation provides an overview of research related to problems in quality evaluation in the mechanisms of wire bond degradation. Case studies presented examine the evaluation of reliability of hermetic and plastic microcircuits with suspected poor wire bonding. The authors conclude that in the cases when destructive physical analysis (DPA) or design evaluation indicate possible problems with wire bonding, a wire bond qualification testing may be required. This test should include high temperature storage (175 degrees C to 200 decrees C) of the parts with periodic measurements of contact resistances followed by internal examination and wire pull or ball sear testing." @default.
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- W2896937875 date "2006-01-01" @default.
- W2896937875 modified "2023-09-27" @default.
- W2896937875 title "Reliability Evaluation of Au/Al Wire Bonds in Commercial Microcircuits" @default.
- W2896937875 hasPublicationYear "2006" @default.
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