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• W2896984712 abstract "This paper explores different means by which the interconnect reliability is improved and interposer warpage is decreased for an interposer-to-board integration platform using mechanically flexible interconnects (MFIs). Central to this exploration is the design and distribution/orientation of the MFIs on the interposer. Using finite-element-based tool ANSYS, different MFI distributions and configurations are investigated. A radially oriented interconnect distribution in which the MFIs line up along the contours of thermal expansion/contraction is evaluated. Furthermore, a multiobjective genetic algorithm is employed to reduce max von-Mises stress in the MFIs and warpage in the interposer for each MFI distribution configuration. The impact of chip size and MFI pitch (from 400 to $1200 μm) on the mechanical integrity of the MFIs and interposer are also explored." @default.
• W2896984712 created "2018-10-26" @default.
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• W2896984712 date "2018-12-01" @default.
• W2896984712 modified "2023-10-16" @default.
• W2896984712 title "Thermomechanical Analysis and Package-Level Optimization of Mechanically Flexible Interconnects for Interposer-on- Motherboard Assembly" @default.
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• W2896984712 doi "https://doi.org/10.1109/tcpmt.2018.2876379" @default.
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