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- W2897153762 abstract "Copper pillar bump, with its feasibility for the ultra-fine-pitch interconnection, have become the mainstream form of advanced packaging. Studies on the copper pillar bump bonding method and intermetallic compounds (IMCs) growth as well as its reliability become the hot spot of the industry. Here we developed a low temperature solid state bonding method for 25 μm-diameter copper pillar bump with Sn cap and Ni micro cones. The optimal bonding parameters include 200°C bonding temperature, 12.2MPa bonding pressure and 300s load hold time. 150°C isothermal aging treatment has been conducted after bonding to simulate the heat effect of electronic products during service. By measuring the thickness of the IMC, the diffusion coefficient of Cu 3 Sn has been obtained. In addition, Kirkendall voids has been observed during aging process." @default.
- W2897153762 created "2018-10-26" @default.
- W2897153762 creator A5021384155 @default.
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- W2897153762 date "2018-08-01" @default.
- W2897153762 modified "2023-10-16" @default.
- W2897153762 title "Investigation on solid state bonding and intermetallic compounds reaction of Cu pillar bump/Ni micro cones" @default.
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- W2897153762 doi "https://doi.org/10.1109/icept.2018.8480703" @default.
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