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- W2897372568 abstract "as the copper pillar bumps with fine pitch and high density were widely applied in high density interconnections packaging. It’s increasingly important to study the interconnection technology of high density micro bumps interconnection. In the paper, we designed Test Vehicle of copper pillar bumps with different material systems for verifying the bonding effect between copper pillar bumps. We compared the bonding experiments of micro bumps structures of three different materials. Finally, the resistance value of a single micro bump bonding structure can be obtained by testing the kelvin structure. Moreover, the test results can be verified by theoretical calculation." @default.
- W2897372568 created "2018-10-26" @default.
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- W2897372568 date "2018-08-01" @default.
- W2897372568 modified "2023-09-26" @default.
- W2897372568 title "Effect of Different Material Systems on Interconnection Properties of 30μm Pitch Micro Bumps" @default.
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- W2897372568 doi "https://doi.org/10.1109/icept.2018.8480482" @default.
- W2897372568 hasPublicationYear "2018" @default.
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