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- W2897529040 abstract "Wafer Level Chip Scale Package (WLCSP) is widely used in portable electronic products like mobile phones, tablets, digital cameras and etc. WLCSP technology is driven by cost, size, and ease of testing and is an ideal solution to package low to middle I/O chips. The main issue of WLCSP is silicon and fragile dielectric crack at the die edge due to an unpackaged die. WLCSP handling defects can occur at any step across the device process flow from WLCSP backend process including dicing, tape and reel packing to the final surface mount of the WLCSP onto the product PCB. The crack at the die edge can diminish the integrity and reliability of the integrated circuit (IC). Die sidewall protection becomes even more critical as silicon nodes scale beyond 22nm to 14nm and 10nm, where the risk of potential sidewall damage intensifies due to the brittle dielectrics. In this work, we have developed a sidewall protection wafer level chip scale package, which leverages the existing manufacturing method of wafer level fan out package and classical WLCSP technology. In the process flow, the wafer is diced, picked and placed on the carrier with adequate distance between the die prior to the wafer molding process. The dies are reconstructed into 300mm molded wafer and then go through the wafer level packaging process. The tested known good dies (KGDs) are surrounded by epoxy molding compound (EMC), a non-brittle material, which prevents damage to the die itself. In this work, we have developed 5mm × 5mm sidewall protection WLCSP with 196 I/O (14 × 14 full array pattern). Pitch is 0.35mm and solder ball size is 200um. Daisy chain WLCSP structure with SAC105Ni solder ball is used. Both board level thermal cycling test and drop test are carried out for this package reliability test. Cu RDL contact resistance is also discussed" @default.
- W2897529040 created "2018-10-26" @default.
- W2897529040 creator A5006552791 @default.
- W2897529040 creator A5027835055 @default.
- W2897529040 creator A5027962680 @default.
- W2897529040 creator A5052287300 @default.
- W2897529040 creator A5083314215 @default.
- W2897529040 date "2018-08-01" @default.
- W2897529040 modified "2023-09-28" @default.
- W2897529040 title "Sidewall Protection for a Wafer Level Chip Scale Package" @default.
- W2897529040 cites W2026654148 @default.
- W2897529040 cites W2098493258 @default.
- W2897529040 cites W2101913025 @default.
- W2897529040 cites W2515619078 @default.
- W2897529040 cites W2744963145 @default.
- W2897529040 doi "https://doi.org/10.1109/icept.2018.8480608" @default.
- W2897529040 hasPublicationYear "2018" @default.
- W2897529040 type Work @default.
- W2897529040 sameAs 2897529040 @default.
- W2897529040 citedByCount "2" @default.
- W2897529040 countsByYear W28975290402020 @default.
- W2897529040 countsByYear W28975290402022 @default.
- W2897529040 crossrefType "proceedings-article" @default.
- W2897529040 hasAuthorship W2897529040A5006552791 @default.
- W2897529040 hasAuthorship W2897529040A5027835055 @default.
- W2897529040 hasAuthorship W2897529040A5027962680 @default.
- W2897529040 hasAuthorship W2897529040A5052287300 @default.
- W2897529040 hasAuthorship W2897529040A5083314215 @default.
- W2897529040 hasConcept C121332964 @default.
- W2897529040 hasConcept C126233035 @default.
- W2897529040 hasConcept C149635348 @default.
- W2897529040 hasConcept C160671074 @default.
- W2897529040 hasConcept C165005293 @default.
- W2897529040 hasConcept C192562407 @default.
- W2897529040 hasConcept C2778638305 @default.
- W2897529040 hasConcept C2778755073 @default.
- W2897529040 hasConcept C2780288131 @default.
- W2897529040 hasConcept C41008148 @default.
- W2897529040 hasConcept C49040817 @default.
- W2897529040 hasConcept C62520636 @default.
- W2897529040 hasConcept C76155785 @default.
- W2897529040 hasConceptScore W2897529040C121332964 @default.
- W2897529040 hasConceptScore W2897529040C126233035 @default.
- W2897529040 hasConceptScore W2897529040C149635348 @default.
- W2897529040 hasConceptScore W2897529040C160671074 @default.
- W2897529040 hasConceptScore W2897529040C165005293 @default.
- W2897529040 hasConceptScore W2897529040C192562407 @default.
- W2897529040 hasConceptScore W2897529040C2778638305 @default.
- W2897529040 hasConceptScore W2897529040C2778755073 @default.
- W2897529040 hasConceptScore W2897529040C2780288131 @default.
- W2897529040 hasConceptScore W2897529040C41008148 @default.
- W2897529040 hasConceptScore W2897529040C49040817 @default.
- W2897529040 hasConceptScore W2897529040C62520636 @default.
- W2897529040 hasConceptScore W2897529040C76155785 @default.
- W2897529040 hasLocation W28975290401 @default.
- W2897529040 hasOpenAccess W2897529040 @default.
- W2897529040 hasPrimaryLocation W28975290401 @default.
- W2897529040 hasRelatedWork W1981648436 @default.
- W2897529040 hasRelatedWork W1991905740 @default.
- W2897529040 hasRelatedWork W2089003336 @default.
- W2897529040 hasRelatedWork W2126680329 @default.
- W2897529040 hasRelatedWork W2135066912 @default.
- W2897529040 hasRelatedWork W2136374712 @default.
- W2897529040 hasRelatedWork W2148933206 @default.
- W2897529040 hasRelatedWork W3031284619 @default.
- W2897529040 hasRelatedWork W3146796940 @default.
- W2897529040 hasRelatedWork W3022215011 @default.
- W2897529040 isParatext "false" @default.
- W2897529040 isRetracted "false" @default.
- W2897529040 magId "2897529040" @default.
- W2897529040 workType "article" @default.