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- W2897713721 abstract "The electroplating of copper by the damascene process is the predominantly used technique for on-chip wiring in the fabrication of ultra-large scale integrated microchips. In this process, void-free superconformal filling of trenches is achieved by multicomponent electrolytes, containing chloride and organic additives in addition to the Cu ions. In this paper we review studies of the atomic-scale Cu interface structure and homoepitaxial Cu electrodeposition behavior in acidic (pH 1–3) Cl-containing electrolyte by in-situ surface X-ray diffraction. This technique provides detailed insight on the 3D atomic arrangement at the electrode surface and fast time-resolved data on the kinetic growth mode. On Cu(111) a complex potential-dependent adlayer structure is found, involving transitions between a chemisorbed oxygen species to a hexagonal close-packed incommensurate chloride adlayer. In contrast, on Cu(001) a simple disorder-order transition to a c(2 × 2) Cl adlayer is found. Parallel to the latter, a crossover from step-flow to layer-by-layer and finally 3D growth occurs during Cu(001) electrodeposition, indicating a decreasing Cu surface mobility toward more positive potentials. The presence of the organic additive polyethylene glycol (PEG) stabilizes the partial c(2 × 2) Cl adlayer on the Cu(001) surface and leads to an inhibition of Cu deposition with a tendency to rougher growth." @default.
- W2897713721 created "2018-10-26" @default.
- W2897713721 creator A5025406953 @default.
- W2897713721 creator A5055525473 @default.
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- W2897713721 date "2018-10-19" @default.
- W2897713721 modified "2023-10-14" @default.
- W2897713721 title "Review—In-Situ Surface X-ray Diffraction Studies of Copper Electrodes: Atomic-Scale Interface Structure and Growth Behavior" @default.
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- W2897713721 doi "https://doi.org/10.1149/2.0071901jes" @default.
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