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- W2897858674 abstract "Fabricating additive fine circuits on insulating PI (Polyimide) layer is a significant process of redistribution layer in WLP (Wafer Level Packaging). A facile method to manufacture highly conductive and fine copper lines on PI film via ELD (electroless deposition) combined with selective surface modification and ion-exchange is developed in this work. In order to initiate the metallization on designed area of PI film, a particular alkaline modifying reagent is printed on PI film to generate functional groups which will adsorb silver ions as catalytical precursor in subsequent electroless copper plating. This chemical bridging approach promotes the adhesive strength between copper patterns and PI film. The resistivity of deposited copper lines is as low as 2.82×10−6 Ω•cm which is 1.6 times of the value for bulk copper. As for practical assessment, copper lines with 10 µm in width fabricated by inkjet printing were obtained and a LED (light emitting diode) connection experiment was performed to validate the reliability of circuit." @default.
- W2897858674 created "2018-10-26" @default.
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- W2897858674 date "2018-08-01" @default.
- W2897858674 modified "2023-09-27" @default.
- W2897858674 title "Fabricating Additive Fine Lines through Selective Surface Modification for WLP-PI layer" @default.
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- W2897858674 doi "https://doi.org/10.1109/icept.2018.8480758" @default.
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