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- W2898023001 abstract "The size of the packaging structure is becoming more and more tiny, thus in this paper, we describe the structure and the performance of a chip packaging type using the cavity in silicon substrate. We present three aspects: the EMI shielding effectiveness, the resonant frequency of the package and the crosstalk." @default.
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- W2898023001 date "2018-08-01" @default.
- W2898023001 modified "2023-10-16" @default.
- W2898023001 title "Electrical Research of Silicon Substrate Packaging Technology Based on the Cavity" @default.
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- W2898023001 doi "https://doi.org/10.1109/icept.2018.8480472" @default.
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