Matches in SemOpenAlex for { <https://semopenalex.org/work/W2898043006> ?p ?o ?g. }
Showing items 1 to 91 of
91
with 100 items per page.
- W2898043006 abstract "Electromigration phenomena in Sn-3.5Ag solders with Cu pillar in the flip chip joints was investigated. The silicon die was mounting on a silicon substrate via thermal-compression bonding process. The diameter of the Cu pillar of flip chip is 40um, meanwhile the thickness of solder bump is 3um. Finite element modeling and analysis were established to understand the influences of Cu pillar structure on the electromigration reliability. The reliability of electromigration in shallow solder bump with Cu pillar was explored for various amounts of time under a high current density of 1×104A/cm2 at 100 °C. After the Sn-3.5Ag solder cap all forms Cu6Sn5 intermetallic compounds with the Cu pillars, the condition of the solder accelerates deterioration to generate many micro voids under the current stressing. However, the resistance of the daisy chain has hardly changed during this period." @default.
- W2898043006 created "2018-10-26" @default.
- W2898043006 creator A5013050862 @default.
- W2898043006 creator A5032057273 @default.
- W2898043006 creator A5063891035 @default.
- W2898043006 date "2018-08-01" @default.
- W2898043006 modified "2023-09-25" @default.
- W2898043006 title "Electromigration in flip chip with Cu pillar having a shallow Sn-3.5Ag solder interconnect" @default.
- W2898043006 cites W1996293017 @default.
- W2898043006 cites W2003636506 @default.
- W2898043006 cites W2017259805 @default.
- W2898043006 cites W2256593329 @default.
- W2898043006 cites W2588800133 @default.
- W2898043006 cites W2792743924 @default.
- W2898043006 doi "https://doi.org/10.1109/icept.2018.8480496" @default.
- W2898043006 hasPublicationYear "2018" @default.
- W2898043006 type Work @default.
- W2898043006 sameAs 2898043006 @default.
- W2898043006 citedByCount "3" @default.
- W2898043006 countsByYear W28980430062019 @default.
- W2898043006 countsByYear W28980430062020 @default.
- W2898043006 countsByYear W28980430062022 @default.
- W2898043006 crossrefType "proceedings-article" @default.
- W2898043006 hasAuthorship W2898043006A5013050862 @default.
- W2898043006 hasAuthorship W2898043006A5032057273 @default.
- W2898043006 hasAuthorship W2898043006A5063891035 @default.
- W2898043006 hasConcept C111368507 @default.
- W2898043006 hasConcept C121332964 @default.
- W2898043006 hasConcept C123745756 @default.
- W2898043006 hasConcept C125619702 @default.
- W2898043006 hasConcept C127313418 @default.
- W2898043006 hasConcept C138055206 @default.
- W2898043006 hasConcept C159985019 @default.
- W2898043006 hasConcept C163258240 @default.
- W2898043006 hasConcept C191897082 @default.
- W2898043006 hasConcept C192562407 @default.
- W2898043006 hasConcept C207740977 @default.
- W2898043006 hasConcept C27501479 @default.
- W2898043006 hasConcept C2777289219 @default.
- W2898043006 hasConcept C2779227376 @default.
- W2898043006 hasConcept C2780026712 @default.
- W2898043006 hasConcept C31258907 @default.
- W2898043006 hasConcept C41008148 @default.
- W2898043006 hasConcept C43214815 @default.
- W2898043006 hasConcept C45632049 @default.
- W2898043006 hasConcept C50296614 @default.
- W2898043006 hasConcept C544956773 @default.
- W2898043006 hasConcept C62520636 @default.
- W2898043006 hasConcept C68928338 @default.
- W2898043006 hasConcept C79072407 @default.
- W2898043006 hasConceptScore W2898043006C111368507 @default.
- W2898043006 hasConceptScore W2898043006C121332964 @default.
- W2898043006 hasConceptScore W2898043006C123745756 @default.
- W2898043006 hasConceptScore W2898043006C125619702 @default.
- W2898043006 hasConceptScore W2898043006C127313418 @default.
- W2898043006 hasConceptScore W2898043006C138055206 @default.
- W2898043006 hasConceptScore W2898043006C159985019 @default.
- W2898043006 hasConceptScore W2898043006C163258240 @default.
- W2898043006 hasConceptScore W2898043006C191897082 @default.
- W2898043006 hasConceptScore W2898043006C192562407 @default.
- W2898043006 hasConceptScore W2898043006C207740977 @default.
- W2898043006 hasConceptScore W2898043006C27501479 @default.
- W2898043006 hasConceptScore W2898043006C2777289219 @default.
- W2898043006 hasConceptScore W2898043006C2779227376 @default.
- W2898043006 hasConceptScore W2898043006C2780026712 @default.
- W2898043006 hasConceptScore W2898043006C31258907 @default.
- W2898043006 hasConceptScore W2898043006C41008148 @default.
- W2898043006 hasConceptScore W2898043006C43214815 @default.
- W2898043006 hasConceptScore W2898043006C45632049 @default.
- W2898043006 hasConceptScore W2898043006C50296614 @default.
- W2898043006 hasConceptScore W2898043006C544956773 @default.
- W2898043006 hasConceptScore W2898043006C62520636 @default.
- W2898043006 hasConceptScore W2898043006C68928338 @default.
- W2898043006 hasConceptScore W2898043006C79072407 @default.
- W2898043006 hasLocation W28980430061 @default.
- W2898043006 hasOpenAccess W2898043006 @default.
- W2898043006 hasPrimaryLocation W28980430061 @default.
- W2898043006 hasRelatedWork W1959855705 @default.
- W2898043006 hasRelatedWork W1988649604 @default.
- W2898043006 hasRelatedWork W2025313931 @default.
- W2898043006 hasRelatedWork W2045684767 @default.
- W2898043006 hasRelatedWork W2070713558 @default.
- W2898043006 hasRelatedWork W2077737073 @default.
- W2898043006 hasRelatedWork W2155465785 @default.
- W2898043006 hasRelatedWork W2260710922 @default.
- W2898043006 hasRelatedWork W2543125352 @default.
- W2898043006 hasRelatedWork W2898043006 @default.
- W2898043006 isParatext "false" @default.
- W2898043006 isRetracted "false" @default.
- W2898043006 magId "2898043006" @default.
- W2898043006 workType "article" @default.