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• W2899252214 abstract "An ex-situ method has been used to study the anisotropy of the epitaxial growth of Ni electrodeposited onto a polycrystalline Cu substrate from a sulfamate solution. Nickel films, approximately 1 μm thick, were deposited galvanostatically onto the polished substrates at current densities ranging from 2 to 250 mA/cm2. The orientations of the Ni deposits and substrates were analyzed through EBSD to reveal the orientation relationship between each deposit/substrate pair. EBSD analysis was also performed for thick deposits to clarify the growth behavior and microstructural evolution on grains having different orientations. At 2 mA/cm2, epitaxial growth to thickness of up to 1 μm was allowed solely on grains having the orientation <100>//ND (normal direction). In contrast, the Ni deposits grew epitaxially on all grains, no matter the orientation, when the current density was in the range from 10 to 100 mA/cm2. The surfaces of the non-{100} oriented epilayers gradually roughened, however, upon increasing their thickness, and the epitaxial growth was eventually prohibited by the formation of a polycrystalline transition layer through a twin-mediated nucleation process. A microstructural evolution model is proposed herein based on the inhibition of the electrolyte and the anisotropic growth of the crystal planes during electrodeposition." @default.
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• W2899252214 date "2018-01-01" @default.
• W2899252214 modified "2023-10-11" @default.
• W2899252214 title "Epitaxial Growth and Microstructural Evolution of Nickel Electrodeposited on a Polycrystalline Copper Substrate" @default.
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• W2899252214 doi "https://doi.org/10.1149/2.0831814jes" @default.
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