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- W2899332465 abstract "This study investigated the thermal properties of three-dimensional (3-D) printed components with the potential to be used for thermal management in light-emitting diode (LED) applications. Commercially available filament materials with and without a metal filler were characterized with changes to the print orientation. 3-D printed components with an in-plane orientation had >30 % better effective thermal conductivity compared with components printed with a cross-plane orientation. A finite-element analysis was modeled to understand the effective thermal conductivity changes in the 3-D printed components. A simple thermal resistance model was used to estimate the required effective thermal conductivity of the 3-D printed components to be a viable alternative in LED thermal management applications." @default.
- W2899332465 created "2018-11-09" @default.
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- W2899332465 date "2018-04-04" @default.
- W2899332465 modified "2023-09-27" @default.
- W2899332465 title "Thermal characterization of three-dimensional printed components for light-emitting diode lighting system applications" @default.
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- W2899332465 doi "https://doi.org/10.1117/1.oe.57.4.041411" @default.
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