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• W2900453553 abstract "Gypsum board is widely used as a finishing material, and it is mixed with functional materials to improve the comfort level of indoor air, provide thermal insulation, and satisfy moisture properties. In addition, Phase change material (PCM) is also used as a functional material to reduce energy consumption. Recently, there have been many studies on improving moisture problems, such as condensation and mold growth. Therefore, the hygrothermal behavior of building materials must be carefully considered to reduce the risk of moisture problems. The objective of this study was to improve the thermal and moisture performance of gypsum board, and achieve energy savings by adding porous material and PCM. The characteristics of functional gypsum board (FGB) with expanded vermiculite (EV), expanded perlite (EP), nano carbon material (C300), and n-octadecane (PCM) were analyzed by fourier transform infrared (FTIR) spectroscopy for structural stability. The thermal conductivities of the various FGBs were analyzed by TCi thermal conductivity analyzer, and their hygroscopic properties were analyzed based on ISO 12,571 and 12,572. In addition, the hygrothermal performance of walls applied with FGB was evaluated using Wäme und Feuchte instationär (WUFI) simulation; the wall composition was concrete wall. As a result, the thermal conductivities of FGB were decreased by 15%, compared with the conventional gypsum board. In the case of moisture properties, the water vapor resistance and water content of FGB were increased, compared with the conventional gypsum board (SR). However, the simulation results showed that there were no moisture problems, such as condensation, mold growth, or structural damage." @default.
• W2900453553 created "2018-11-29" @default.
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• W2900453553 date "2019-01-01" @default.
• W2900453553 modified "2023-10-14" @default.
• W2900453553 title "Analysis of walls of functional gypsum board added with porous material and phase change material to improve hygrothermal performance" @default.
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• W2900453553 doi "https://doi.org/10.1016/j.enbuild.2018.11.023" @default.
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