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- W2902562904 abstract "The paper describes a model of plasma chemical etching of silicon in CCl 2 F 2 /O 2 plasma with teflon coating of the reactor walls. It is established that the chlorine atoms lead to a shift in the maximum of the dependence of the etching rate of silicon on the oxygen content in the gas mixture to ~90%, in comparison with fluorine containing plasmas. It is shown that the proposed model of the process explains all the currently known experimental data for CCl 2 F 2 /O 2 plasma. The model is applicable to other chlorine containing mixtures, at least when silicon is etched." @default.
- W2902562904 created "2018-12-11" @default.
- W2902562904 creator A5076959145 @default.
- W2902562904 date "2018-10-01" @default.
- W2902562904 modified "2023-09-24" @default.
- W2902562904 title "The Role of Chlorine Atoms in Etching Silicon in the Plasma of CF<inf>2</inf>Cl<inf>2</inf>/O<inf>2</inf>" @default.
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- W2902562904 doi "https://doi.org/10.1109/apeie.2018.8545065" @default.
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