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- W2902581114 abstract "We investigated back electrodes for ZnSnP 2 photovoltaic devices. When copper was used as back electrode, the current was increased and Cu/ZnSnP 2 junction showed an ohmic behavior after heat treatment. Observation of the interface structure revealed that the interdiffusion of copper, tin and phosphorus occurred after annealing, and Cu 3 P and Cu 3 Sn were formed. This implies that these two compounds contributed to the formation of ohmic junction with low resistivity." @default.
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- W2902581114 date "2018-06-01" @default.
- W2902581114 modified "2023-09-22" @default.
- W2902581114 title "Impact of structure on carrier transport behavior at the interface between electrode and ZnSnP<inf>2</inf> absorber" @default.
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- W2902581114 doi "https://doi.org/10.1109/pvsc.2018.8547478" @default.
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