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• W2906674328 abstract "In this study, the role of octylphenol ethoxylate (Triton X-100) surfactant as a suppressor in Cu electrodeposition has been examined. The inhibition ability of Triton X-100 was qualitatively and quantitatively evaluated with cyclic voltammograms and Koutecký–Levich plots, and compared with that of polyethylene glycol (PEG) with similar molecular size. The presence of a hydrophobic benzene-ring in its structure made it inhibit Cu deposition more strongly than PEG. The inhibition function of Triton X-100 depended on the substrate material and it was influenced by the presence of Cl− and bis sulphopropyl disulphide in the electrolyte indicating that the characteristics of Triton X-100 were similar to those of PEG, which was also demonstrated by gap filling of Cu with using Triton X-100 in the replacement of PEG. The effect of Triton X-100 on the properties of the deposit film was also investigated, and it was found that it suppressed the three-dimensional growth of Cu." @default.
• W2906674328 created "2019-01-01" @default.
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• W2906674328 date "2018-12-24" @default.
• W2906674328 modified "2023-10-10" @default.
• W2906674328 title "Octylphenol ethoxylate surfactant as a suppressor in copper electrodeposition" @default.
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• W2906674328 doi "https://doi.org/10.1080/00202967.2019.1551276" @default.
• W2906674328 hasPublicationYear "2018" @default.
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