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• W2909286116 abstract "In this study, composite solder pastes with different sizes of Sn and Cu particles were prepared. A large fraction of solid/liquid interfacial contacts adjusted by the Cu particle sizes contributed to an ultra-rapid metallurgical reaction at a high in-situ temperature of 437.1 °C under ultrasonic waves. Thus, the sole IMC of high-melting-point Cu3Sn joints with a tiny proportion of residual Cu were obtained in air at 250 °C for 10 s under the ultrasonic-assisted transient liquid phase (TLP). The intermetallic joints exhibited the average shear strength of 49.96 MPa at ambient temperature. In particular, a promising shear strength of 46.54 MPa was obtained at the high temperature of 350 °C, which exhibits significant potential for the high temperature electronic devices." @default.
• W2909286116 created "2019-01-25" @default.
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• W2909286116 date "2019-05-01" @default.
• W2909286116 modified "2023-10-15" @default.
• W2909286116 title "Enhancing the solid/liquid interfacial metallurgical reaction of Sn+Cu composite solder by ultrasonic-assisted chip attachment" @default.
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• W2909286116 doi "https://doi.org/10.1016/j.jallcom.2019.01.090" @default.
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