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- W2910130605 abstract "This paper presents a self-adjusting nanowire bonding process to produce free-standing point-to-point electrical connections. Wire diameters up to 200 nm and contact pads up to 1 μrm are shown. In addition, the process is a parallel process to achieve higher throughput compared to the new serial direct write or established serial wire bonding methods. Generated nanoparticles are captured directly on the substrate, resulting in a high material yield. The method presented is based on what is best described as “gas-phase electrodeposition”." @default.
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- W2910130605 date "2018-10-01" @default.
- W2910130605 modified "2023-10-01" @default.
- W2910130605 title "Self Aligning Growth of Nanoparticle-Based Interconnects" @default.
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- W2910130605 doi "https://doi.org/10.1109/nmdc.2018.8605857" @default.
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