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• W2910356950 endingPage "71" @default.
• W2910356950 startingPage "61" @default.
• W2910356950 abstract "Abstract Lead-free tin-based solder joints often have a single-grained structure with random orientation and highly anisotropic properties. These alloys are typically stiffer than lead-based solders, hence transfer more stress to printed circuit boards (PCBs) during thermal cycling. This may lead to cracking of the PCB laminate close to the solder joints, which could increase the PCB flexibility, alleviate strain on the solder joints, and thereby enhance the solder fatigue life. If this happens during accelerated thermal cycling it may result in overestimating the lifetime of solder joints in field conditions. In this study, the grain structure of SAC305 solder joints connecting ceramic resistors to PCBs was studied using polarized light microscopy and was found to be mostly single-grained. After thermal cycling, cracks were observed in the PCB under the solder joints. These cracks were likely formed at the early stages of thermal cycling prior to damage initiation in the solder. A finite element model incorporating temperature-dependant anisotropic thermal and mechanical properties of single-grained solder joints is developed to study these observations in detail. The model is able to predict the location of damage initiation in the PCB and the solder joints of ceramic resistors with reasonable accuracy. It also shows that the PCB cracks of even very small lengths may significantly reduce accumulated creep strain and creep work in the solder joints. The proposed model is also able to evaluate the influence of solder anisotropy on damage evolution in the neighbouring (opposite) solder joints of a ceramic resistor." @default.
• W2910356950 created "2019-01-25" @default.
• W2910356950 creator A5018153398 @default.
• W2910356950 creator A5021914347 @default.
• W2910356950 creator A5052549009 @default.
• W2910356950 creator A5052651414 @default.
• W2910356950 creator A5089240711 @default.
• W2910356950 date "2019-02-01" @default.
• W2910356950 modified "2023-09-24" @default.
• W2910356950 title "Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints" @default.
• W2910356950 cites W1168687777 @default.
• W2910356950 cites W1860020236 @default.
• W2910356950 cites W1873272073 @default.
• W2910356950 cites W1967789973 @default.
• W2910356950 cites W1967940210 @default.
• W2910356950 cites W2006321326 @default.
• W2910356950 cites W2006872267 @default.
• W2910356950 cites W2047835810 @default.
• W2910356950 cites W2049317061 @default.
• W2910356950 cites W2063603901 @default.
• W2910356950 cites W2073033825 @default.
• W2910356950 cites W2081279252 @default.
• W2910356950 cites W2088949951 @default.
• W2910356950 cites W2089356180 @default.
• W2910356950 cites W2094364009 @default.
• W2910356950 cites W2125541185 @default.
• W2910356950 cites W2129620871 @default.
• W2910356950 cites W2158255245 @default.
• W2910356950 cites W2262041538 @default.
• W2910356950 cites W2343914242 @default.
• W2910356950 cites W2490495112 @default.
• W2910356950 cites W2542931011 @default.
• W2910356950 cites W2619153834 @default.
• W2910356950 cites W2623158428 @default.
• W2910356950 cites W2745669836 @default.
• W2910356950 cites W2768871014 @default.
• W2910356950 cites W2785720782 @default.
• W2910356950 cites W2789111672 @default.
• W2910356950 cites W2804075299 @default.
• W2910356950 cites W948450273 @default.
• W2910356950 cites W2750876901 @default.
• W2910356950 doi "https://doi.org/10.1016/j.microrel.2019.01.006" @default.
• W2910356950 hasPublicationYear "2019" @default.
• W2910356950 type Work @default.
• W2910356950 sameAs 2910356950 @default.
• W2910356950 citedByCount "21" @default.
• W2910356950 countsByYear W29103569502019 @default.
• W2910356950 countsByYear W29103569502020 @default.
• W2910356950 countsByYear W29103569502021 @default.
• W2910356950 countsByYear W29103569502022 @default.
• W2910356950 countsByYear W29103569502023 @default.
• W2910356950 crossrefType "journal-article" @default.
• W2910356950 hasAuthorship W2910356950A5018153398 @default.
• W2910356950 hasAuthorship W2910356950A5021914347 @default.
• W2910356950 hasAuthorship W2910356950A5052549009 @default.
• W2910356950 hasAuthorship W2910356950A5052651414 @default.
• W2910356950 hasAuthorship W2910356950A5089240711 @default.
• W2910356950 hasBestOaLocation W29103569501 @default.
• W2910356950 hasConcept C121332964 @default.
• W2910356950 hasConcept C127413603 @default.
• W2910356950 hasConcept C153294291 @default.
• W2910356950 hasConcept C159985019 @default.
• W2910356950 hasConcept C163258240 @default.
• W2910356950 hasConcept C166957645 @default.
• W2910356950 hasConcept C177564732 @default.
• W2910356950 hasConcept C187937830 @default.
• W2910356950 hasConcept C191897082 @default.
• W2910356950 hasConcept C192562407 @default.
• W2910356950 hasConcept C204530211 @default.
• W2910356950 hasConcept C43214815 @default.
• W2910356950 hasConcept C49040817 @default.
• W2910356950 hasConcept C50296614 @default.
• W2910356950 hasConcept C541528975 @default.
• W2910356950 hasConcept C62520636 @default.
• W2910356950 hasConcept C66938386 @default.
• W2910356950 hasConcept C95457728 @default.
• W2910356950 hasConceptScore W2910356950C121332964 @default.
• W2910356950 hasConceptScore W2910356950C127413603 @default.
• W2910356950 hasConceptScore W2910356950C153294291 @default.
• W2910356950 hasConceptScore W2910356950C159985019 @default.
• W2910356950 hasConceptScore W2910356950C163258240 @default.
• W2910356950 hasConceptScore W2910356950C166957645 @default.
• W2910356950 hasConceptScore W2910356950C177564732 @default.
• W2910356950 hasConceptScore W2910356950C187937830 @default.
• W2910356950 hasConceptScore W2910356950C191897082 @default.
• W2910356950 hasConceptScore W2910356950C192562407 @default.
• W2910356950 hasConceptScore W2910356950C204530211 @default.
• W2910356950 hasConceptScore W2910356950C43214815 @default.
• W2910356950 hasConceptScore W2910356950C49040817 @default.
• W2910356950 hasConceptScore W2910356950C50296614 @default.
• W2910356950 hasConceptScore W2910356950C541528975 @default.
• W2910356950 hasConceptScore W2910356950C62520636 @default.
• W2910356950 hasConceptScore W2910356950C66938386 @default.
• W2910356950 hasConceptScore W2910356950C95457728 @default.
• W2910356950 hasFunder F4320321030 @default.
• W2910356950 hasLocation W29103569501 @default.
• W2910356950 hasLocation W29103569502 @default.
• W2910356950 hasOpenAccess W2910356950 @default.

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