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• W2911997750 abstract "2.5D assembly, a package with stacking GPU and HBM chips onto through silicon via interposer (TSI), then mounted onto organic substrate is now mass produced and dedicated package solution for high performance and large volume numerical calculation applications. However, high cost for TSI wafer and substrate, also the large/thick package dimension and long assembly cycle time of 2.5D package are also limit its penetration of high performance applications. The applications using 2.5D package are continuously drive OSATs to thinner the outline dimension and assembly cycle time, especially the cost of 2.5D package, wish to apply this assembly platform on a wider field.A directly derivative of 2.5D package with thinner thickness/cost is to eliminate the organic substrate, and make the function of organic substrate as an RDL circuits onto the TSV interposer, so called TSI-FCBGA (patented). As a package without organic substrate, the outline dimension of this package will be only half of original structure. It will also shorten the cycle time of secondary assembly processes of chip modules onto organic substrate. As to eliminate organic substrate, the original at least 6 layers circuits on it is now re-distributed onto TSV interposer will make the RDL circuits on TSV interposer with fine line space and pitch to ensure matchable I/O before and after eliminating the organic substrate. Thus, the interconnection solder ball size and pitch will be smaller than that of original package with organic substrate. However, there is no reliability data available for this TSI-FCBGA package with smaller solder ball size and pitch.For the work of this paper, we modified platform of 2.5D package chip module with changing C4 side micro bump to solder ball, as a test vehicle of TSI-FCBGA, and demonstrated the board level reliability of it with different solder ball type, size, pitch, also molded solder ball on TSV interposer with daisy chain circuits. The results show the board level reliability of this thinner 2.5D package can pass mostly 733 thermal cycles with definite solder ball types and properties, though it is a little worse than original 2.5D package with organic substrate. Simulations are furtherly executed to find better structure of UBM and RDLs for future study." @default.
• W2911997750 created "2019-02-21" @default.
• W2911997750 creator A5002517519 @default.
• W2911997750 creator A5003549848 @default.
• W2911997750 creator A5025485967 @default.
• W2911997750 creator A5032812073 @default.
• W2911997750 creator A5054754143 @default.
• W2911997750 creator A5077358636 @default.
• W2911997750 creator A5082789932 @default.
• W2911997750 date "2018-10-01" @default.
• W2911997750 modified "2023-09-24" @default.
• W2911997750 title "Board Level Reliability of Thinner Stacking Chips Package with Through Silicon Via Interposer" @default.
• W2911997750 cites W2019275594 @default.
• W2911997750 cites W2063893206 @default.
• W2911997750 cites W2162135055 @default.
• W2911997750 cites W2749199255 @default.
• W2911997750 doi "https://doi.org/10.1109/impact.2018.8625837" @default.
• W2911997750 hasPublicationYear "2018" @default.
• W2911997750 type Work @default.
• W2911997750 sameAs 2911997750 @default.
• W2911997750 citedByCount "0" @default.
• W2911997750 crossrefType "proceedings-article" @default.
• W2911997750 hasAuthorship W2911997750A5002517519 @default.
• W2911997750 hasAuthorship W2911997750A5003549848 @default.
• W2911997750 hasAuthorship W2911997750A5025485967 @default.
• W2911997750 hasAuthorship W2911997750A5032812073 @default.
• W2911997750 hasAuthorship W2911997750A5054754143 @default.
• W2911997750 hasAuthorship W2911997750A5077358636 @default.
• W2911997750 hasAuthorship W2911997750A5082789932 @default.
• W2911997750 hasConcept C100460472 @default.
• W2911997750 hasConcept C111106434 @default.
• W2911997750 hasConcept C111368507 @default.
• W2911997750 hasConcept C119599485 @default.
• W2911997750 hasConcept C123745756 @default.
• W2911997750 hasConcept C126233035 @default.
• W2911997750 hasConcept C127313418 @default.
• W2911997750 hasConcept C127413603 @default.
• W2911997750 hasConcept C134146338 @default.
• W2911997750 hasConcept C146667757 @default.
• W2911997750 hasConcept C158802814 @default.
• W2911997750 hasConcept C159985019 @default.
• W2911997750 hasConcept C160671074 @default.
• W2911997750 hasConcept C162877825 @default.
• W2911997750 hasConcept C165005293 @default.
• W2911997750 hasConcept C165013422 @default.
• W2911997750 hasConcept C171250308 @default.
• W2911997750 hasConcept C178790620 @default.
• W2911997750 hasConcept C184788189 @default.
• W2911997750 hasConcept C185592680 @default.
• W2911997750 hasConcept C186260285 @default.
• W2911997750 hasConcept C192562407 @default.
• W2911997750 hasConcept C24326235 @default.
• W2911997750 hasConcept C2777289219 @default.
• W2911997750 hasConcept C2779227376 @default.
• W2911997750 hasConcept C33347731 @default.
• W2911997750 hasConcept C41008148 @default.
• W2911997750 hasConcept C45632049 @default.
• W2911997750 hasConcept C49040817 @default.
• W2911997750 hasConcept C50296614 @default.
• W2911997750 hasConcept C530198007 @default.
• W2911997750 hasConcept C68928338 @default.
• W2911997750 hasConcept C76155785 @default.
• W2911997750 hasConcept C94709252 @default.
• W2911997750 hasConceptScore W2911997750C100460472 @default.
• W2911997750 hasConceptScore W2911997750C111106434 @default.
• W2911997750 hasConceptScore W2911997750C111368507 @default.
• W2911997750 hasConceptScore W2911997750C119599485 @default.
• W2911997750 hasConceptScore W2911997750C123745756 @default.
• W2911997750 hasConceptScore W2911997750C126233035 @default.
• W2911997750 hasConceptScore W2911997750C127313418 @default.
• W2911997750 hasConceptScore W2911997750C127413603 @default.
• W2911997750 hasConceptScore W2911997750C134146338 @default.
• W2911997750 hasConceptScore W2911997750C146667757 @default.
• W2911997750 hasConceptScore W2911997750C158802814 @default.
• W2911997750 hasConceptScore W2911997750C159985019 @default.
• W2911997750 hasConceptScore W2911997750C160671074 @default.
• W2911997750 hasConceptScore W2911997750C162877825 @default.
• W2911997750 hasConceptScore W2911997750C165005293 @default.
• W2911997750 hasConceptScore W2911997750C165013422 @default.
• W2911997750 hasConceptScore W2911997750C171250308 @default.
• W2911997750 hasConceptScore W2911997750C178790620 @default.
• W2911997750 hasConceptScore W2911997750C184788189 @default.
• W2911997750 hasConceptScore W2911997750C185592680 @default.
• W2911997750 hasConceptScore W2911997750C186260285 @default.
• W2911997750 hasConceptScore W2911997750C192562407 @default.
• W2911997750 hasConceptScore W2911997750C24326235 @default.
• W2911997750 hasConceptScore W2911997750C2777289219 @default.
• W2911997750 hasConceptScore W2911997750C2779227376 @default.
• W2911997750 hasConceptScore W2911997750C33347731 @default.
• W2911997750 hasConceptScore W2911997750C41008148 @default.
• W2911997750 hasConceptScore W2911997750C45632049 @default.
• W2911997750 hasConceptScore W2911997750C49040817 @default.
• W2911997750 hasConceptScore W2911997750C50296614 @default.
• W2911997750 hasConceptScore W2911997750C530198007 @default.
• W2911997750 hasConceptScore W2911997750C68928338 @default.
• W2911997750 hasConceptScore W2911997750C76155785 @default.
• W2911997750 hasConceptScore W2911997750C94709252 @default.
• W2911997750 hasLocation W29119977501 @default.
• W2911997750 hasOpenAccess W2911997750 @default.
• W2911997750 hasPrimaryLocation W29119977501 @default.

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