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- W2912119166 abstract "This chapter overviews the electronic properties of a power delivery network (PDN) of integrated circuit (IC) chips, involving interactions with packages and printed circuit boards associated with system-level assembly. The closer looks are provided for frequency-domain impedance of a PDN with resonating peaks and how they are altered mainly by intentional decoupling capacitors and parasitic inductive components. The understandings are mainly given for conventional 2D-IC chips while extended for 2.5D and 3D constructions." @default.
- W2912119166 created "2019-02-21" @default.
- W2912119166 creator A5070370721 @default.
- W2912119166 date "2019-02-08" @default.
- W2912119166 modified "2023-10-12" @default.
- W2912119166 title "Power Delivery Network and Integrity in <scp>3D</scp> ‐ <scp>IC</scp> Chips" @default.
- W2912119166 cites W2117000040 @default.
- W2912119166 doi "https://doi.org/10.1002/9783527697052.ch3" @default.
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