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• W2912350877 abstract "In this chapter newest research on three-dimensional integration is described. Three promising methods for 3D integration of using copper micro pillars, interwafer connects, and through-silicon vias are introduced. The application of these 3D-integration techniques in the integration of photonic chips on top of electronic chips is described subsequently. Four application examples, a multi-node optical switch, a transceiver, a sensor for optical tomography, and a sensor for 3D microimaging are explained in detail from system architecture down to the transistor level." @default.
• W2912350877 created "2019-02-21" @default.
• W2912350877 creator A5048460512 @default.
• W2912350877 date "2018-01-01" @default.
• W2912350877 modified "2023-09-27" @default.
• W2912350877 title "Circuits for Electronic-Photonic Integration" @default.
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• W2912350877 doi "https://doi.org/10.1007/978-3-030-05822-7_7" @default.
• W2912350877 hasPublicationYear "2018" @default.
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