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• W2912479983 abstract "Just find a way to stay cool: The confluence of high-power chip heat dissipation and localized hot spots expose the limitations of current cooling methods in electronics. To overcome these limitations it is essential to rapidly spread the on-chip sites heat generation and dissipate the extracted heat. The authors investigate the impact of the combination of a diamond heat-spreading layer and microfluidic convection on the performance of a model electronic chip with localized heating. It is shown experimentally and numerically that this combination can significantly reduce the maximum chip temperature." @default.
• W2912479983 created "2019-02-21" @default.
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• W2912479983 date "2019-01-24" @default.
• W2912479983 modified "2023-10-13" @default.
• W2912479983 title "Enhanced Cooling of Electronic Chips Using Combined Diamond Coating and Microfluidics" @default.
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• W2912479983 doi "https://doi.org/10.1103/physrevapplied.11.014047" @default.
• W2912479983 hasPublicationYear "2019" @default.
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