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- W2912667517 abstract "Batch processing of aluminum nitride (AlN) by thermal atomic layer deposition (ALD) was studied at high temperatures of 500–550 °C using aluminum chloride (AlCl3) and ammonia (NH3) as metal and nitrogen precursors. The growth behavior, chemical composition, morphology, crystallinity, and residual stress of the AlN films were characterized by ellipsometry, x-ray photoelectron spectroscopy, atomic force microscopy, scanning electron microscopy, x-ray diffraction, and the wafer curvature method, respectively. The deposited AlN films at 525 °C had a good batch thickness uniformity of 2.6%, a low surface roughness of ∼1 nm, a low Cl impurity level of ∼1.2%, and a hexagonal polycrystalline structure with a preferential (002) orientation. An obvious dependence between film properties and deposition temperature was found. The evaluation in deposition temperature from 500 to 550 °C resulted in an increase of the growth-per-cycle, refractive index, and tensile stress as well as a decrease of Cl and O impurity levels in the AlN films. Based on these findings, the authors concluded that high quality polycrystalline AlN films with a preferential (002) orientation can be grown with ALD in a large batch reactor at high temperatures (500–550 °C).Batch processing of aluminum nitride (AlN) by thermal atomic layer deposition (ALD) was studied at high temperatures of 500–550 °C using aluminum chloride (AlCl3) and ammonia (NH3) as metal and nitrogen precursors. The growth behavior, chemical composition, morphology, crystallinity, and residual stress of the AlN films were characterized by ellipsometry, x-ray photoelectron spectroscopy, atomic force microscopy, scanning electron microscopy, x-ray diffraction, and the wafer curvature method, respectively. The deposited AlN films at 525 °C had a good batch thickness uniformity of 2.6%, a low surface roughness of ∼1 nm, a low Cl impurity level of ∼1.2%, and a hexagonal polycrystalline structure with a preferential (002) orientation. An obvious dependence between film properties and deposition temperature was found. The evaluation in deposition temperature from 500 to 550 °C resulted in an increase of the growth-per-cycle, refractive index, and tensile stress as well as a decrease of Cl and O impurity level..." @default.
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- W2912667517 date "2019-03-01" @default.
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- W2912667517 title "Batch processing of aluminum nitride by atomic layer deposition from AlCl<sub>3</sub> and NH<sub>3</sub>" @default.
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- W2912667517 doi "https://doi.org/10.1116/1.5079509" @default.
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