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- W29140275 abstract "By far the single largest application for GaAs RFICs in commercial/consumer platforms is in mobile telephone handsets covering several standards such as analog AMPS, digital PCS TDMA and CDMA, Japanese PHS, European GSM, DCS1800 and DECT. However, a considerable number of technologies are potentially availabie for RFIC designs such as Si BiCMOS, Si LDMOS, SiGe, GaAs MESFET, GaAs pHEMT, AIGaAs and InGaP HBT. After a brief review of competing technologies, emphasis in this paper is placed on describing a number of examples of GaAs RFiC designs used in present telephones concentrating on the highest performance parts required in PCS and dual-band CDMA platforms. Integration of receive and transmit functions, providing substantial area reduction and integration improvement for next generation platform applications, will be described such as a PCS transmitter module containing GaAs upconverter, driver amplifier and power amplifier ICs. Technologies are compared for future higher levels of integration allowing the production of one-chip radios." @default.
- W29140275 created "2016-06-24" @default.
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- W29140275 date "1998-10-01" @default.
- W29140275 modified "2023-09-27" @default.
- W29140275 title "GaAs RFICs For mobile telephone applications -- A review" @default.
- W29140275 hasPublicationYear "1998" @default.
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