Matches in SemOpenAlex for { <https://semopenalex.org/work/W2918517981> ?p ?o ?g. }
Showing items 1 to 85 of
85
with 100 items per page.
- W2918517981 abstract "3D packaging technology offers great benefits such as reduced power consumption, improved performance, and reduced form factor. Among three key processes in 3D packaging a low temperature Cu-to-Cu wafer bonding is the subject of interest in this study. To accommodate high conductivity, non-formation of intermetallic compound, fine pitch connectivity, high pin count, and low cost, Cu-to-Cu wafer bonding is becoming increasingly important in advanced IC device packaging manufacturing. However, for high bonding quality, Cu-to-Cu wafer bonding requires high temperature process above $400^{circ}mathrm{C}$, which is not allowed in IC device packaging manufacturing. In this study the effect of Ar-N 2 plasma treatment on Cu surface was investigated for low temperature Cu-to-Cu wafer bonding applications. Ar gas is used in a plasma ignition and the activation of Cu surface by ion bombardments, and the purpose of N 2 gas was to passivate u surface from contaminations such as –O or –OH. The Cu/Ti/SiO 2 /Si specimens were fabricated on 8-inch Si wafers. Then various Ar-N 2 plasma treatments were performed on Cu wafer surface. After the Ar-N 2 plasma treatments, electrical and structural properties were analyzed by X-ray diffraction, X-ray photoelectron spectroscopy, atomic force microscope, and 4-point probe measurements. It has been confirmed that Ar-N 2 plasma treatment can provide copper oxide removal and copper nitride passivation at the topmost Cu surface." @default.
- W2918517981 created "2019-03-11" @default.
- W2918517981 creator A5029788267 @default.
- W2918517981 creator A5038612664 @default.
- W2918517981 date "2018-12-01" @default.
- W2918517981 modified "2023-10-16" @default.
- W2918517981 title "Effect of Ar-N<inf>2</inf>Plasma Treatment on Copper Surface for Cu-to-Cu Wafer Bonding" @default.
- W2918517981 cites W1969530042 @default.
- W2918517981 cites W1987643409 @default.
- W2918517981 cites W1988631867 @default.
- W2918517981 cites W1993593851 @default.
- W2918517981 cites W2014605960 @default.
- W2918517981 cites W2018668032 @default.
- W2918517981 cites W2023070535 @default.
- W2918517981 cites W2032430168 @default.
- W2918517981 cites W2056721705 @default.
- W2918517981 cites W2063181653 @default.
- W2918517981 cites W2098547240 @default.
- W2918517981 cites W2155816545 @default.
- W2918517981 cites W2777469729 @default.
- W2918517981 doi "https://doi.org/10.1109/eptc.2018.8654291" @default.
- W2918517981 hasPublicationYear "2018" @default.
- W2918517981 type Work @default.
- W2918517981 sameAs 2918517981 @default.
- W2918517981 citedByCount "0" @default.
- W2918517981 crossrefType "proceedings-article" @default.
- W2918517981 hasAuthorship W2918517981A5029788267 @default.
- W2918517981 hasAuthorship W2918517981A5038612664 @default.
- W2918517981 hasConcept C113196181 @default.
- W2918517981 hasConcept C121332964 @default.
- W2918517981 hasConcept C127413603 @default.
- W2918517981 hasConcept C159985019 @default.
- W2918517981 hasConcept C160671074 @default.
- W2918517981 hasConcept C175708663 @default.
- W2918517981 hasConcept C185592680 @default.
- W2918517981 hasConcept C191897082 @default.
- W2918517981 hasConcept C192562407 @default.
- W2918517981 hasConcept C201414436 @default.
- W2918517981 hasConcept C2779133538 @default.
- W2918517981 hasConcept C2779227376 @default.
- W2918517981 hasConcept C2779869380 @default.
- W2918517981 hasConcept C33574316 @default.
- W2918517981 hasConcept C42360764 @default.
- W2918517981 hasConcept C43617362 @default.
- W2918517981 hasConcept C49040817 @default.
- W2918517981 hasConcept C544778455 @default.
- W2918517981 hasConcept C62520636 @default.
- W2918517981 hasConcept C82706917 @default.
- W2918517981 hasConceptScore W2918517981C113196181 @default.
- W2918517981 hasConceptScore W2918517981C121332964 @default.
- W2918517981 hasConceptScore W2918517981C127413603 @default.
- W2918517981 hasConceptScore W2918517981C159985019 @default.
- W2918517981 hasConceptScore W2918517981C160671074 @default.
- W2918517981 hasConceptScore W2918517981C175708663 @default.
- W2918517981 hasConceptScore W2918517981C185592680 @default.
- W2918517981 hasConceptScore W2918517981C191897082 @default.
- W2918517981 hasConceptScore W2918517981C192562407 @default.
- W2918517981 hasConceptScore W2918517981C201414436 @default.
- W2918517981 hasConceptScore W2918517981C2779133538 @default.
- W2918517981 hasConceptScore W2918517981C2779227376 @default.
- W2918517981 hasConceptScore W2918517981C2779869380 @default.
- W2918517981 hasConceptScore W2918517981C33574316 @default.
- W2918517981 hasConceptScore W2918517981C42360764 @default.
- W2918517981 hasConceptScore W2918517981C43617362 @default.
- W2918517981 hasConceptScore W2918517981C49040817 @default.
- W2918517981 hasConceptScore W2918517981C544778455 @default.
- W2918517981 hasConceptScore W2918517981C62520636 @default.
- W2918517981 hasConceptScore W2918517981C82706917 @default.
- W2918517981 hasLocation W29185179811 @default.
- W2918517981 hasOpenAccess W2918517981 @default.
- W2918517981 hasPrimaryLocation W29185179811 @default.
- W2918517981 hasRelatedWork W2007557890 @default.
- W2918517981 hasRelatedWork W2020374723 @default.
- W2918517981 hasRelatedWork W2029050535 @default.
- W2918517981 hasRelatedWork W2029637008 @default.
- W2918517981 hasRelatedWork W2083290419 @default.
- W2918517981 hasRelatedWork W2112404977 @default.
- W2918517981 hasRelatedWork W2134706490 @default.
- W2918517981 hasRelatedWork W2152766841 @default.
- W2918517981 hasRelatedWork W2171418261 @default.
- W2918517981 hasRelatedWork W2918517981 @default.
- W2918517981 isParatext "false" @default.
- W2918517981 isRetracted "false" @default.
- W2918517981 magId "2918517981" @default.
- W2918517981 workType "article" @default.